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PCB Material List

PCB Material List - Organic polymer ceramic fiberglass cloth copper clad laminate series WL-CT350

PCB Material List

PCB Material List - Organic polymer ceramic fiberglass cloth copper clad laminate series WL-CT350

Organic polymer ceramic fiberglass cloth copper clad laminate series WL-CT350

WL-CT350 is made of organic polymer, ceramic filler and glass fiber cloth through scientific preparation and strict process. It is a thermosetting material, and its performance is comparable to similar foreign products. It is suitable for 4G, 5G, base station antennas, automotive radars and sensors., Power amplifiers, microwave devices, high-reliability radars, military communication devices, satellite tuner, etc.


WL-CT350 Product parameters:

Exterior

Meet the requirements of the national military standard for microwave printed circuit substrate materials

Model number

WL-CT350

Dielectric constant

Dielectric constant (10GHZ): 3.48±0.05 Dielectric loss tangent value (10GHZ): 0.004

Dimensions(mm)

610*460 600*500 915*1224

Special size can be pressed according to customer requirements

Copper foil optional specifications

Forward copper foil: 0.5OZ, 1 OZ

Thickness size and tolerance (mm)

Media thickness (mm)

0.102

0.168

0.254

0.338

0.422

0.508

0.762

1.016

1.524

公 差

±0.01

±0.015

±0.02

±0.03

±0.03

±0.03

±0.05

±0.05

±0.08

Special thickness can be customized: starting from 0.508mm thickness, increasing with 0.0838mm thickness

Mechanical behavior

Copper foil peeling strength(10Z)

WL-CT350

9N/cm

Thermal Stress

Dip tin, 280 degree Celsius*10s, ≧3 times, no delamination, no blistering

Chemical properties

According to the characteristics of the substrate, the circuit can be processed by referring to the chemical corrosion method of the printed circuit, and the dielectric properties of the material will not change.

Physical electrical properties

Indicator name

Test Conditions

Unit

Index value

Tg

TMA

degree Celsius

>280

Td

TGA

degree Celsius

386

Proportion

Normal


1.9

Water absorption

Soak in distilled water at 20±2 degree Celsius for 24 hours

%

0.05

Operating temperature

High and low temperature box

degree Celsius

-50~+260

Thermal conductivity


Kcal/mh degree Celsius

0.70

Thermal expansion coefficient

(Typical value)

-55 º~288ºC

ppm/ºC

X

Y

Z

11

14

34

Surface insulation resistance

500V

DC

Normal

M.Ω

≥4*108

Constant heat and humidity

≥1*107

Volume resistance

Normal

MΩ.cm

≥1*109

Constant heat and humidity

≥1*108

Temperature Coefficient of Dielectric Constant

(PPM/ ºC)

-50 º~150ºC

52

Dielectric loss tangent

2.5GHZ

tgδ

0.0032

10GHZ

tgδ

0.0040

Flame retardant

94V-0

WL-CT350 Features:

1. Organic polymer ceramic fiberglass cloth is a thermosetting resin system, which has better hardness than PTFE thermoplastic resin system and has a good loss value.

2. The values of DK and DF are stable, and DK/DF changes little as the frequency increases.

3. Excellent electrical performance, excellent thermal conductivity, better insulation performance and heat treatment ability than PTFE materials.

4. Compatible with FR-4 processing technology, without plasma treatment, processing technology is relatively simple, compatible with most PP sheets, PCB processability is excellent, especially suitable for PCB multi-layer board processing.

5. The low thermal expansion coefficient improves the reliability and dimensional stability of plated through holes.

6. Especially suitable for lead-free soldering process.

6. WL-CT350 can replace Rogers RO4350B in some occasions.