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Talking about the classification summary of Shenzhen circuit board factory

Talking about the classification summary of Shenzhen circuit board factory
How much do you know about circuit boards? How many people know PCB circuit boards? Our circuit board manufacturers are by no means ordinary circuit boards, but high-quality PCBs produced by circuit board factories. Today, the editor of the circuit board factory will hold a classification summary meeting of Shenzhen circuit board factory for everyone. With the help of many years of experience and The experience of Shenzhen PCB Factory has become more and more active in recent years, hurry up and learn!

The first thing I want to introduce to you is the PCB copper clad laminate. In the Shenzhen circuit board industry, the copper clad laminate is the most basic material for the production of PCB circuit boards, and it is also the primary purchase object of major circuit board manufacturers.

1. PCB Copper Clad Laminate (CCL)

1. Classification

Rigid CCL is divided into: paper substrate, ring fiber cloth substrate, composite substrate, special type

A. Paper substrate

B. Ring fiber cloth substrate

D, special type

2. Substrate material

Talking about the classification summary of Shenzhen circuit board factory

   (1) Mainly used in circuit board factory production

a. Electronic-grade alkali-free glass cloth is usually used. Commonly used models are 1080, 2116, 7826, etc.

b. Impregnated fiber paper

c, copper foil

Classification according to the production method of copper foil: rolled copper foil and electrolytic copper foil

The standard thickness of copper foil is: 18um (HOZ), 35um (1OZ) and 70um (2OZ)

In addition, 12um (1/3OZ) and high-thickness copper foils have been put on the market. In the circuit board industry, these are all necessary data and materials for the production of PCB circuit boards. At the same time, the Shenzhen circuit board industry has special control data in this regard.

 FR-4 fiberglass board is generally divided into:

FR-4 rigid circuit board, common board thickness is 0.8-3.2mm;

FR-4 thin circuit board, common board thickness is less than 0.78mm.

The general technical indicators of FR-4 glass fiber circuit board materials are:

Bending strength, peel strength, thermal shock performance, flame retardancy, volume resistivity, surface resistance, dielectric constant, dielectric loss tangent, glass transition temperature Tg, dimensional stability, maximum use temperature, warpage, etc.

  3, prepreg (Prepreg or PP)

PP is a pre-impregnated material composed of resin and reinforced materials. The resin is a semi-cured "B-stage" resin. The commonly used PP in circuit board factories generally uses FR-4 prepreg.

  4, composite base CCL

It is mainly divided into CEM-1 (epoxy paper-based core material) and CEM-3 (epoxy glass fiber non-woven fabric core). The main difference between FR-4 and FR-4 is the specific core material is sandwiched between the substrate. Its various performances are not much different from FR-4, and each has its own advantages and disadvantages. The main performance is that CEM is better than FR in terms of processing performance and heat resistance. -4 strong. The general technical indicators of CEM material are roughly the same as FR-4.

Whether it is a PCB factory in Shenzhen or a PCB factory in various places, the PCB production process requires many processes to be produced. It is just that the Shenzhen PCB factory has become more active in recent years. After the summary meeting of this class, you have learned NS?