PCB News - Introduction to common standards in printed circuit boards

Introduction to common standards in printed circuit boards

1. IPC-ESD-2020: A joint standard for the development of electrostatic discharge control procedures. Including the necessary design, establishment, implementation and maintenance of electrostatic discharge control procedures. According to the historical experience of certain military organizations and commercial organizations, it provides guidance for handling and protecting electrostatic discharge sensitive periods.

2. IPC-SA-61A: Semi-aqueous cleaning manual after making and soldering PCB circuit board. Including all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, technology, process control, and environmental and safety considerations.

3. IPC-AC-62A: Water cleaning manual for circuit board after soldering. Describe the cost of manufacturing residues, the types and properties of aqueous cleaning agents, the process of aqueous cleaning, equipment and techniques, quality control, environmental control, employee safety, and cleanliness measurement and measurement.

4. IPC-DRM-40E: Desktop reference manual for through-hole solder joint evaluation of circuit boards. Detailed description of components, hole walls and welding surface coverage according to standard requirements, in addition to including computer-generated 3D graphics. Covers tin filling, contact angle, tin dip, vertical filling, solder pad coverage, and numerous solder joint defects.

5. IPC-TA-722: Circuit board welding technology evaluation manual. Including articles on all aspects of printed circuit board soldering technology, including general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor-phase soldering and infrared soldering.

6. IPC-7525: Template Design Guide. Provide guidelines for the design and manufacture of solder paste and surface mount adhesive coating templates i also discussed template design using surface mount technology, and introduced the use of through-hole or flip chip components? Technology, including overprinting, double printing and staged template design.

7. IPC/EIAJ-STD-004: Specification requirements for flux include Appendix I. Contains technical indicators and classifications of rosin, resin, etc., organic and inorganic fluxes classified according to the content and activation degree of halides in the flux; also includes the use of flux, substances containing flux, and low-temperature fluxes used in the no-clean process. Flux residue.

8. IPC/EIAJ-STD-005: Specification requirements for solder paste include Appendix I. Lists the characteristics and technical index requirements of solder paste, including test methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and solder paste wetting performance.

9. IPC/EIAJ-STD-006A: Specification requirements for electronic grade solder alloy, flux and non-flux solid solder. For electronic grade solder alloys, rod-shaped, strip-shaped, powdered flux and non-flux solder, for electronic solder applications, and provide terminology, specification requirements and test methods for special electronic grade solders.

10. IPC-3406: Guidelines for Coating Adhesives on Conductive Surfaces. Provide guidance for the selection of conductive adhesives as solder alternatives in electronic manufacturing.

11. IPC/EIA/JEDECJ-STD-003A. Solderability test of printed circuit boards.

12. IPC-Ca-821: General requirements for thermally conductive adhesives. Including the requirements and test methods for thermally conductive dielectrics to bond components to appropriate locations.

13. IPC-TR-460A: Printed circuit board wave soldering troubleshooting list. A list of recommended corrective actions for failures that may be caused by wave soldering.

14. IPC-7530: Temperature curve guide for batch soldering process (reflow soldering and wave soldering). Various test methods, techniques and methods are used in the acquisition of the temperature curve to provide guidance for establishing the best graph.