Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
PCB News

PCB News - One article to understand the three differences between PCB factory aluminum substrate and glass fiber board

PCB News

PCB News - One article to understand the three differences between PCB factory aluminum substrate and glass fiber board

One article to understand the three differences between PCB factory aluminum substrate and glass fiber board

2021-09-19
View:363
Author:Aure

One article to understand the three differences between PCB factory aluminum substrate and glass fiber board


PCB factory: What is fiberglass board?

Alien fiberglass board: fiberglass insulation board, fiberglass board (FR-4), fiberglass composite board, fiberglass material and high-temperature heat-resistant composite material, without asbestos harmful to the human body.

It has high mechanical and dielectric properties, good heat resistance and humidity, and has good healing power.

The invention is used in plastic molds, injection molds, machine manufacturing, forming machines, drilling machines, injection molding machines, motors, and circuit boards. Lighting equipment, tableware.

Fiberglass panels are made of fabric and leather to create a beautiful decoration on walls and ceilings, which include acoustics, sound insulation, heat insulation, environmental protection and flame retardant properties.

1. Advantages of fiberglass board

(1) It has high mechanical and electrical properties, good heat resistance and humidity, and good processing ability. Usually used to make plastic molds and machinery.

(2) Injection molding generally requires high-temperature materials and low-temperature molds. The isolation method must be used under the same aircraft conditions. Keep the injection mold at low temperature without making the temperature of the injection machine too high. The insulating plate between the injection mold and the injection machine can meet this requirement.

Shorten the production cycle, improve productivity, reduce energy consumption, improve product quality, and continue the production process to ensure stable product quality, prevent overheating of the machine tool, no electrical failure, and oil leakage in the hydraulic system

2. Application of fiberglass board

1) Construction industry: cooling towers, building structures, indoor equipment and decorative parts, FRP panels, decorative panels and solar equipment can be used.


One article to understand the three differences between PCB factory aluminum substrate and glass fiber board



(2) Chemical and chemical industry: It can be used as corrosion-resistant pipes, corrosion-resistant pumps and accessories, fences, ventilation devices, wastewater and wastewater treatment equipment, etc.

(3) Railway and automobile transportation industry: it can be used as automobiles and other parts, and as a barrier for shells, doors, linings and large tourist vehicles; in the construction of expressways, there are signaling, separation walls and G. Safety luggage, etc. The performance of fiberglass board, fiberglass board, can usually be used for flexible funds, and then add fabric, leather, etc., can become a beautiful decoration for walls and ceilings. It provides sound absorption, acoustics, heat insulation, environmental protection and flame retardant absorption capacity. Good insulating properties have made it used in radar housings and make it a good anti-corrosion material. Now it is widely used in the chemical industry. Glass fiber board has strong plasticity.

2. What is an aluminum substrate?

The aluminum substrate is a laminated material of metal copper plating with good heat dissipation function.

Usually, a board consists of three layers, namely the circuit layer (copper foil), the insulating layer and the metal substrate. For high-end applications, there are also double-layer boards composed of circuit layers, insulating layers, aluminum bases, insulating layers and circuit layers.

There are few applications for multi-layer boards, which can be made by normal multi-layer boards based on insulating layers and aluminum.

1. Advantages of aluminum substrate

(1) The heat dissipation is better than the standard FR-4 structure.

(2) The thermal conductivity of the dielectric used is usually 5 to 10 times that of epoxy glass, and its thickness is only ten times.

(3) The heat transfer index is more effective than rigid printed circuits.

(4) A copper weight lower than the copper weight recommended for IPC can be used.

two.

2. The use of aluminum substrate

(1) Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, pre-amplifiers, power amplifiers, etc.

(2) Power supply equipment: switching regulators, CC/CA converters, SW regulators, etc.

(3) Electronic communication equipment: high-frequency amplifiers, filters, transmission circuits.

(4) Office automation equipment: motor drivers, etc.

(5) Automobiles: electronic regulators, igniters, power controllers, etc.

(6) Computer: CPU card, disk drive, power supply equipment, etc.

(7) Power modules: converters, solid state relays, rectifier bridges, etc. Aluminum substrates are widely used in audio equipment, power supply equipment, electronic communication equipment, office automation equipment, automobiles, computers, and power modules.

3. Design of aluminum substrate

2. The main technical requirements are as follows:

Dimension requirements, including board size and deviation, thickness and deviation, vertical and high discharge; appearance, including cracks, peeling, layers and layers, aluminum oxide film and other requirements; performance, including resistance to peeling resistance, minimum breaking voltage, dielectric Constant, fire resistance and heat resistance.

Special test methods for aluminum-based copper laminates: One method is to measure the dielectric constant and dielectric loss factor. For the series resonance method of variable Q sequence, the sample and the judgment capacitor are connected in series to the high frequency circuit to measure the Q value of the serial circuit.

The second is the method of measuring thermal resistance, which is calculated from the ratio of temperature and heat conduction between different temperature measurement points.

4. Manufacturing of aluminum substrate circuit boards

(1) Processing: After drilling, it is not allowed to use aluminum substrate on the inner hole after drilling, which will affect the pressure test. This contour is difficult. The pointer profile must use an advanced matrix, which is a difficulty with aluminum substrates because of its precision manufacturing. After the pointer, the boat must be very clean, without chatter, and without touching the solder layer on the board. Generally, after the pointer, after the pointer, the use of the pointer, the line perforation, the shape of the perforation on the aluminum surface, the perforation force of the printed circuit board, etc. are uplink and downlink, etc.

(2) During the entire production process, it is not allowed to divide the aluminum-based surface into the aluminum-based surface: the aluminum-based surface will be removed in contact with or using chemical substances, which is unacceptable, which is absolutely unacceptable. Some customers will not accept the polishing of the aluminum base surface. Therefore, a difficulty encountered in the production of aluminum substrates is that the entire process does not affect the surface of the aluminum substrate. Some companies use passivation technology, while others relax the protective film before and after hot air (spraying)... There are many small skills. Eight undead people crossed the sea, and each showed his own magic.

(3) High voltage test: The aluminum substrate of the communication power supply requires a 100% high voltage test. Some customers require continuous current, while other customers require exchange currents. The voltage requirements are 1500V, 1600V, 5 seconds, 10 seconds, and 100%. % Printed circuit. Dirt on the surface of the panel, grooves on the edges of the holes and aluminum base, serrations on the wire, and any contact with the insulating layer can cause fires, leaks, and failures during high-voltage tests. The pressure test panel was laminated and worn, and therefore was rejected.

2. The use of aluminum substrate

(1) Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, pre-amplifiers, power amplifiers, etc.

(2) Power supply equipment: switching regulators, CC/CA converters, SW regulators, etc.

(3) Electronic communication equipment: high-frequency amplifiers, filters, transmission circuits.

(4) Office automation equipment: motor drivers, etc.

(5) Automobiles: electronic regulators, igniters, power controllers, etc.

(6) Computer: CPU card, disk drive, power supply equipment, etc.

(7) Power modules: converters, solid state relays, rectifier bridges, etc. Aluminum substrates are widely used in audio equipment, power supply equipment, electronic communication equipment, office automation equipment, automobiles, computers, and power modules.

3. Design of aluminum substrate

1. The main technical requirements are as follows: Dimensional requirements, including board size and deviation, thickness and deviation, vertical and high release; appearance, including cracks, peeling, layers and layers, aluminum oxide film and other requirements; performance, including resistance to peeling Elasticity, minimum breaking voltage, dielectric constant, fire resistance and heat resistance.

2. Special test methods for aluminum-based copper laminates: One method is to measure the dielectric constant and dielectric loss factor. For the series resonance method of variable Q sequence, the sample and the judgment capacitor are connected in series to the high frequency circuit to measure the Q value of the serial circuit. The second is the method of measuring thermal resistance, which is calculated from the ratio of temperature and heat conduction between different temperature measurement points.

4. Manufacturing of aluminum substrate circuits

(1) Processing: After drilling, it is not allowed to use aluminum substrate on the inner hole after drilling, which will affect the pressure test. This contour is difficult. The pointer profile must use an advanced matrix, which is a difficulty with aluminum substrates because of its precision manufacturing. After the pointer, the boat must be very clean, without chatter, and without touching the solder layer on the board. Generally, after the pointer, after the pointer, the use of the pointer, the line perforation, the shape of the perforation on the aluminum surface, the perforation force of the printed circuit board, etc. are uplink and downlink, etc.

(2) During the entire production process, it is not allowed to divide the aluminum-based surface into the aluminum-based surface: the aluminum-based surface will be removed in contact with or using chemical substances, which is unacceptable, which is absolutely unacceptable. Some customers will not accept the polishing of the aluminum base surface. Therefore, a difficulty encountered in the production of aluminum substrates is that the entire process does not affect the surface of the aluminum substrate. Some companies use passivation technology, while others relax the protective film before and after hot air (spraying)... There are many small skills. Eight undead people crossed the sea, and each showed his own magic.

(3) High voltage test: The aluminum substrate of the communication power supply requires a 100% high voltage test. Some customers require continuous current, while other customers require exchange currents. The voltage requirements are 1500V, 1600V, 5 seconds, 10 seconds, and 100%. % Printed circuit. Dirt on the surface of the panel, grooves on the edges of the holes and aluminum base, serrations on the wire, and any contact with the insulating layer can cause fires, leaks, and failures during high-voltage tests. The pressure test panel was laminated and worn, and therefore was rejected. ipcb is a high-precision, high-quality PCB manufacturer, such as: isola 370hr PCB, high-frequency PCB, high-speed PCB, ic substrate, ic test board, impedance PCB, HDI PCB, Rigid-Flex PCB, buried blind PCB, advanced PCB, microwave PCB, telfon PCB and other ipcb are good at PCB manufacturing.