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How to deal with failures during SMT factory placement
2021-10-04
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Author:Frank

How to deal with failures during SMT factory placement
iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, produces standardized and qualified PCB products, masters complex process technology, and uses professional equipment such as AOI and Flying Probe to control production and X-ray inspection machines. Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.
(1) Failed to pick up the film
    If you can't find the components, consider checking and handling according to the following factors.
    ①The height of the pick-up during SMT placement is not appropriate. Due to the wrong component thickness or Z-axis height setting, correct it according to the actual value after inspection.

②The pick-up coordinates are not appropriate. It may be that the feeding center of the feeder has not been adjusted properly, and the feeder should be re-adjusted.

③The plastic film of the braid feeder is not torn. It is usually caused by the tape not being installed in place or the reel is improperly tight. The feeder should be readjusted.

④ The suction nozzle is clogged, and the suction nozzle should be cleaned.

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⑤There is dirt or cracks on the end of the suction nozzle, causing air leakage.

⑥The nozzle model is not suitable, too large aperture will cause air leakage, too small aperture will cause insufficient suction.

⑦The air pressure is insufficient or the air path is blocked, check whether the air path is leaking, increase the air pressure or clear the air path.

(2) Abandoning or dropping films frequently

Consider checking and dealing with the following factors.

① The image processing is incorrect, and the image should be taken again.

② The pins of the components are deformed.

③ The size, shape and color of the components are inconsistent. For the components packaged in tubes and trays, the discarded parts can be collected and the image can be re-photographed.

④ Inappropriate nozzle model, insufficient vacuum suction and other reasons cause the flying film on the way of patching.

⑤ There is solder paste or other dirt on the end of the nozzle, causing air leakage.

⑥ The nozzle end is damaged or cracked, causing air leakage.

The above is the problem of failure during the patch processing of the smt factory and the treatment method according to the specific situation.
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB factory is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.