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PCB Tech

PCB Tech

PCB Tech

PCB Tech

High Density Interconnect (HDI) PCB

HDI technology is developing rapidly in the field of printed circuit boards. This technology allows denser and smaller board structures and packaging, allowing more components per square inch. Basically, it has more technical functions in less space. Facts have proved that HDI is invaluable and critical in producing smaller and more compact electronic equipment. As we know today, without HDI, mobile phones, laptops, and high-speed performance and computing would not be possible.

printed circuit boards

Examples of HDI technology include fine lines and spaces, sequential lamination, post-drilling, non-conductive and conductive via filling, blind vias, buried vias, and microvias. These are specialized printed circuit board technologies that allow for tight and micro packaging. They also allow higher levels of performance such as controlled impedance and satellite technology.


Manufacturing high-density integrated circuit boards brings higher costs, but it must be accepted and mastered in order to meet the increasingly demanding requirements of the electronics industry.