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PCB Tech

PCB Tech

PCB Tech

PCB Tech

Introduction of PCB fabrication process

Taking the PCB fabrication process of double sided PCB and 4layers PCB as an example, the PCB fabrication process of printed circuit board includes etching process and electroplating process, which is a combination of various processes.

According to the predetermined design to make printed circuit, printed components or a combination of the two conductive graphics known as printed circuit. The following describes the PCB fabrication process.

PCB fabrication process

PCB fabrication process

Basic process PCB fabrication method of printed circuit board:

1. Cutting

Objective: according to the requirements of engineering data mi, cut into small pieces of fabrication plate on the large sheet material which meets the requirements of the customer

Process: large plate → cutting plate according to MI requirements → curizing plate → fillet / edge grinding → plate out

2. Drilling

Objective: according to the engineering data, drill the required hole diameter on the plate with required size

Process: fold plate pin → upper plate → drill hole → lower plate → check and repair

3. Copper deposition

Objective: copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method

Process: rough grinding → hanging board → semi-automatic copper sinking line → plate lowering → 100% dilute H2SO4 dipping → thickening copper

4. Graphic transfer

Objective: graphic transfer is to transfer the image from film to board

Process: (blue oil process): grinding plate → printing the first side → baking → printing the second side → baking → exposure → development → investigation; (dry film process): Hemp board → lamination → standing → alignment → exposure → standing → standing → development → arrest

5. Pattern plating

Objective: pattern electroplating is to electroplate a layer of copper layer with required thickness and gold nickel or tin layer on the exposed copper sheet or hole wall of circuit pattern

Process: upper plate → degreasing → secondary water washing → micro corrosion → water washing → pickling → copper plating → water washing → acid pickling → tin plating → water washing → lower plate

6. Depigmentation

Objective: to remove the anti - plating coating with NaOH solution to expose the non - line copper layer

Process flow: water film: inserting rack → soaking alkali → washing → washing → passing machine; dry film: placing plate → passing machine

PCB fabrication equipment

PCB fabrication equipment

7. Rotten engraving

Objective: etching is to use the chemical reaction method to corrode the copper layer of non - line parts

8. Green oil

Objective: green oil is to transfer the figure of green film to the board to take care of the circuit and block the tin on the circuit when welding parts

Process: grinding plate → printing photosensitive green oil → curium plate → exposure → development; grinding plate → printing the first side → drying plate → printing the second side → drying plate

9. Character

Objective: character is an easy to identify mark provided

Process: green oil final curium → cooling and standing → screen adjustment → character printing → rear curium

10. Gold Plated finger

Objective: to coat the finger of plug with a layer of nickel / gold layer of required thickness to make it more wear-resistant

Process: plate loading → degreasing → twice water washing → micro etching → twice water washing → pickling → copper plating → water washing → nickel plating → water washing → gold plating tin plate (a kind of parallel process)

Objective: tin spraying is to spray a layer of lead and tin on the exposed copper surface which is not covered with solder blocking oil, so as to protect the copper surface from corrosion and oxygenation as much as possible, so as to ensure satisfactory welding performance. The process: Micro etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → scrubbing and air drying

11. Molding

Objective: through the production model stamping or digital control gongs and gongs, we can produce the style and molding method required by customers. Organic gongs, beer boards, small gongs, and hand cutting explain clearly: the numerical gongs, machine boards and beer boards are very accurate, and the small gongs are second, the manual cutting boards can only make a simple shape

12. Testing

Objective: to test the open circuit, short circuit and other defects that affect the functionality of the device

Process: mold → plate placement → test → standard compliance → FQC visual inspection → unqualified standard → repair → retest → OK → rej → discard

13. Final inspection

Objective: through 100% visual inspection of the board appearance defects, and repair the small defects, to prevent the problems and the lack of plate outflow

Process: incoming materials → inspection data → visual inspection → compliance with standards → FQA sampling inspection → conforming to standards → packaging → substandard standards → disposal → checking and checking OK