PCB Tech - Advantages of pcba foundry and production process focus

The continuous progress of economic development and the improvement of the production process of electronic equipment have given the PCBA foundry method an unprecedented opportunity for improvement. Today, I will talk about "the advantages of PCBA foundry materials and the focus of production process".

1. What are the advantages of PCBA foundry materials?

First, it is well known that if companies want to streamline their production, they need a certain amount. Because the price of the MOQ of the product is very high, many small and medium-sized enterprises in the early start of the business if they use the PCB OEM model, it will often lead to a situation where they cannot make ends meet. With the development of the industry, a small PCB OEM model has emerged, allowing companies to conduct OEM business even if they only have a few sets of products. This greatly reduces the threshold for batches and enables more electronic products to be sold in After the design is completed, you can directly enter the foundry state, which greatly shortens the production cycle.

Second, in the past, if you wanted to conduct PCBA OEM business, the manufacturer's production volume was absolutely required. The production batch is not enough, and manufacturers have to pay a lot of additional management expenses. However, with the development of the foundry industry, the foundry business for small enterprises has emerged. The current manufacturers do not have to worry about the previous problems at all. The manufacturer will only increase the appropriate cost based on the customer's list, instead of letting the customer directly bear the related management costs. This not only makes it easier for customers to accept, but also lowers the threshold for businesses to start.

PCBA foundry material

Second, the process focus of PCBA foundry production

The technological focus of PCBA foundry production is the key point required by PCBA foundry production process technology or process method. Mastering the key points of smt patch proofing is equivalent to grasping the soul of smt patch technology and methods. No matter how complicated and changeable the bad welding phenomenon is encountered, PCBA factories can analyze and solve problems in the right direction.

For example, if you do not understand that the BGA soldering process of the PCB circuit board has to go through the two processes of two collapse and deformation in the small batch processing of SMT proofing, it is very difficult to understand the meaning of the BGA soldering peak temperature and soldering time. For example, if you don't know that lead solder paste soldering and lead-free BGA will change the characteristics of the melting point and composition of the solder joints, it is not easy to understand how complicated the mixing process is.

Therefore, it is very important to understand the key points of PCB processing while learning the smt patch processing technology. It is the basic knowledge for analyzing and solving difficult SMT patch proofing process problems. Surface assembly soldering technology, that is, the smt patch proofing process is a more complex soldering technology and smt is constantly evolving, from leaded processes to environmentally friendly lead-free processes, from large pad soldering to micro-pad soldering, PCB processing Continuous development and upgrading, but the most basic principles remain unchanged.

Mastering the process essentials of PCBA processing, engineering knowledge, the causes and treatment methods of common bad welding phenomena can make SMT patch technology more mature and stable, and establish an effective quality control system. It is of great practical significance to quickly solve the problem of smt processing and production technology.