Electronic Design - How to make through-hole design in high-speed PCB design?

iPCB is a PCB design company specializing in electronic product circuit board design (layout wiring design). It mainly undertakes multi-layer, high-density PCB design drawing board and circuit board design proofing business. Next, I will introduce how to do through-hole design in high-speed PCB design.

As we all know, in high-speed PCB design, seemingly simple vias often have a great negative impact on circuit design. Therefore, in high-speed PCB design, we should try our best to do the following:

1. Considering both cost and signal quality, choose a reasonable through hole size. For example, for 6-10 layer memory module high-speed PCB design, it is best to choose 10/20mil (drilling/soldering pad) through-hole PCB. For some small-sized high-density boards, you can also try to use 8/18mil through-hole PCBs under current technical conditions, and it is difficult to use smaller-sized through-holes. For through-hole PCBs for power or ground wires, a larger size can be considered to reduce impedance.

2. Use a thinner PCB board, which helps to reduce the two parasitic parameters through holes.

3. Try not to change the signal routing layer on the PCB board, that is, try not to use unnecessary holes.

4. The power and ground pins should be closest to the hole, and the shorter the hole and the pin, the better, because they will increase the inductance. At the same time, the power and ground leads should be as thick as possible to reduce impedance.

5. Set a ground hole near the hole in the signal layer to make the signal provide the nearest loop. In addition, remember that the process needs to be flexible. The through-hole PCB model has pads on each layer. Of course, we can also reduce or even remove some layer pads. Especially when the density of through holes is very high, it may cause grooves separating circuits to appear in the copper layer. At this time, in addition to moving the position of the via, you can also consider reducing the size of the via pad in the copper layer.

iPCB circuit board design capabilities

The highest signal design rate: 10Gbps CML differential signal;

The highest number of PCB design layers: 40 layers;

Minimum line width: 2.4mil;

Minimum line spacing: 2.4mil;

Minimum BGA PIN spacing: 0.4mm;

Minimum mechanical hole diameter: 6mil;

Minimum laser drilling diameter: 4mil;

Maximum PIN number: 63000+;

Maximum number of components: 3600;

Maximum number of BGA: 48+.

iPCB PCB design service process

1. Customers provide schematic diagrams to consult PCB design;

2. Evaluate the quotation according to the schematic diagram and customer design requirements;

3. The customer confirms the quotation, signs the contract, and prepays the project deposit;

4. Receive advance payment, arrange engineer design;

5. After the design is completed, provide a screenshot of the file to the customer for confirmation;

6. The customer confirms OK, settles the balance, and provides PCB design information.