Smart Phone Main board PCB

About Smart phone main board PCB (HDI PCB) lead time:

12 layers 3-level HDI PCB,15-18 days for proofing, 15-25 days for batches, special multi-layer PCB proofing and special negotiation for batch delivery, ipcb can make Smart phone main board PCB(HDI PCB) fast prototype fabrication and the fastest delivery time for 12-layer 3-level HD IPCB is 7 days.

For the Smart phone main board PCB(HDI PCB) process capability of ipcb, please click HDI PCB Technics Capacity.

iPCB Circuits Limited(iPCB®) is a high-tech enterprise focus on the R&D and production of precision PCB prototype. iPCB independently developed the first PCB Automatic Quotation System(PAQS) in the industry, which automatically connected our PCB factory to realize intelligent service and PCB prototype rapid fabrication. Our ultimate goal is to build an Internet + industry 4.0 intelligent PCB factory cluster to provide professional PCB technology and PCB prototype fabrication services for customers.

iPCB® manufactures microwave radio frequency(RF) PCB, hybrid high frequency PCB, (1-70layers) multilayer PCB, HDI PCB, rigid-flex PCB, metal based PCB, ceramic PCB. We have deep research on PCB with special requirements such as blind buried hole PCB, back drilling PCB, step slot PCB, IC carrier PCB, ultra thick copper PCB, etc