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IC Substrate

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IC Substrate

Ceramic circuit board for semiconductor refrigeration chip

The application range of semiconductor refrigeration fins is very small, and the largest application range is the application in the field of computer hardware. With the current increasing requirements for computing performance and integration, the requirements for heat dissipation are also increasing. , The large heat generated due to frequency increase has always been a problem discussed by overclockers, from air-cooling, water-cooling, to compressors, semiconductor refrigeration, to crazy liquid nitrogen, dry ice, exhausting

cooling methods. The more common air-cooled radiators and water-cooled have become the standard configuration for entry-level overclocking enthusiasts due to their low cost and ease of use. The disadvantage is that even if it is air-cooled or water-cooled, the temperature can only be controlled close to or equal to Ambient temperature. In order to lower the temperature below zero, enthusiasts chose compressors and semiconductor refrigeration. VapoChill and Mach series compressors can make the evaporator temperature reach -50°C through phase change refrigeration, while the three-stage compressor system made by foreign enthusiasts even reaches -196°C, which is equivalent to the evaporation temperature of liquid nitrogen.

 However, due to the high price of the compressor system, it can only be accepted by a small number of enthusiasts. Liquid nitrogen and dry ice may be limited tools for ashes enthusiasts, and the evaporation/sublimation speed is very fast, which can only bring a short-term limited performance. There is no practical value, so semiconductor refrigeration has become a choice.

Semiconductor cooling fins are a kind of cooling device composed of semiconductors. The power of a single semiconductor cooling fin is very low, but if an array is used, the heat dissipation requirements will be very large. This is also the reason why the semiconductor cooling fins have always used ceramic substrates. Only ceramic substrates can meet the heat dissipation requirements of semiconductor refrigeration fins.

 semiconductor refrigeration chip

The bonding strength between the metal layer and the ceramic of Stoneon ceramic circuit board is high, the electrical performance is good, and it can be repeatedly welded. The thickness of the metal layer can be adjusted within 1μm-1mm. The resolution of L/S can reach 10μm. It can directly realize electroplating and sealing. Form a double-sided substrate to provide customers with customized, high-density circuit board solutions.

The material of Stoneon ceramic circuit board is hot immediately because of its strong performance, heat resistance, pressure resistance and other aspects. It can not only operate without load under the strong pressure of household appliances, but also has great aerospace. application.

  Ceramic circuit board technical parameters:

  Solderability: It can be welded at 260℃ for many times, and it can be used for a long time within -20~80℃

  High frequency loss: small, can be used for high frequency circuit design and assembly

  Line/spacing (L/S) resolution: up to 20μm

  Organic ingredients: no organic ingredients, radiation resistant

  Oxide layer: Does not contain an oxide layer, and can be used for a long time in a reducing atmosphere