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Summary of common problems and solutions for circuit board paste dry film
2021-08-23
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Author:Aure

Summary of common problems and solutions for circuit board paste dry film

With the continuous development of the electronics industry and the continuous upgrading of products, in order to save the space of the circuit board, many circuit boards have been designed with very small lines. The previous wet film can no longer meet the current graphics transfer process. , Nowadays, small lines are usually produced with dry film, so what problems do we have in the process of filming? The editor of Zhongke Circuit Board Factory will introduce it below.
Summary of common problems and solutions for PCB circuit board paste dry film
01Bubble appears between the dry film and the surface of the copper foil
Bad problem: Choosing a flat copper foil is the key to ensuring no bubbles.
Solution: increase the pressure of the PCB circuit board film, and the board should be handled gently.
Bad problem: The surface of the heat press roller is not flat, there are pits and the film is dirty.
Solution: Regularly check and protect the flatness of the surface of the hot pressing roller.
Bad problem: The temperature of the PCB film is too high, causing some contact materials to produce wrinkles due to temperature differences.
Solution: Reduce the temperature of the PCB circuit board film.


Summary of common problems and solutions for circuit board paste dry film

02Dry film wrinkles
Bad problem: The dry film is too sticky, so be careful when placing the board during the operation.
Solution: Once contact occurs, it should be dealt with in time.
Bad problem: The board is overheated before the PCB circuit board is pasted.
Solution: The preheating temperature of the circuit board should not be too high.
03The dry film is not firmly attached to the copper foil
Bad problem: The surface of the copper foil is not properly cleaned, and the direct operation will leave oil stains or oxide layers.
Solution: Wear gloves to wash the plate.
Bad problem: The quality of the dry film solvent is not up to standard or has expired.
Solution: The circuit board manufacturer should choose high-quality dry film and check the shelf life of the dry film regularly.
Bad problem: fast transmission speed, low temperature of PCB circuit board film.
Solution: Change the filming speed of the PCB circuit board and the filming temperature of the PCB circuit board.
Bad problem: The humidity in the processing environment is too high, which leads to a prolonged dry film bonding time.
Solution: Keep the relative humidity of the production environment at 50%.
04 more glue
Bad problem: The quality of the dry film is poor.
Solution: Replace the dry film.
Bad problem: The exposure time is too long.
Solution: Have an understanding of the materials used and carry out a reasonable exposure time.
Bad problem: the developer is ineffective.
Solution: Change the developer.
The Co., Ltd. is a circuit board manufacturer, focusing on the production of high-multilayer circuit boards, impedance PCB boards, thick copper boards, HDI boards, blind buried via circuit boards, FPC rigid-flex boards, PCB circuit board proofing and small and medium batch production Manufacturing.