PCB News - The difference between SMT, BOM and SMD

The difference between SMT, BOM and SMD
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
With the advancement of technology, some electronic products such as mobile phones and tablet computers are trending towards being light, small and portable. The electronic components used in Shenzhen SMT processing are also becoming smaller, and there are also a large number of 0402 resistors and capacitors. Replaced by 0201 size.

But most people still don’t know the difference between SMT, BOM, and SMD. Let’s study with the editor today!

SMT patch refers to the abbreviation of a series of technological processes that are processed on the basis of PCB. PCB means printed circuit board.

SMT is a surface assembly technology, which is currently the most popular technology and process in the electronics assembly industry. Electronic circuit surface assembly technology is called surface mount or surface mount technology. It is a circuit assembly technology that mounts no-lead or short-lead surface assembly components on the surface of a printed circuit board or other substrates, and then solders and assembles them by reflow soldering or dip soldering.

Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so all kinds of electrical appliances need a variety of smt patch processing techniques to process.

Bill of Material (BOM), using computer-aided enterprise production management, must first enable the computer to read the product composition manufactured by the enterprise and all the materials to be involved, in order to facilitate the computer to identify, must use the graphical representation of the product The structure is transformed into a certain data format. The file that describes the product structure in the data format is the bill of materials, which is the BOM

It is a technical document that defines the product structure, so it is also called a product structure table or a product structure tree. In some industrial fields, it may be called "recipe", "element table" or other names.

In the MRP 2 and ERP systems, the term material has a broad meaning. It is a collective term for all production-related materials such as products, semi-finished products, work-in-progress, raw materials, supporting parts, collaborative parts, consumables, and so on.

SMD: It is the abbreviation of Surface Mounted Devices, which means: surface mount device, which is one of SMT (Surface Mount Technology) components. In the initial stage of electronic circuit board production, the via assembly is completely completed manually. After the introduction of the first automated machines, they can place some simple pin components, but complex components still need to be manually placed before wave soldering. Surface mounted components (Surface Mounted components) mainly include rectangular chip components, cylindrical chip components, composite chip components, and special-shaped chip components. We are not an agent
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