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High frequency PCB

Hybrid PCB

High frequency PCB

Hybrid PCB

Hybrid PCB

Product Name: Hybrid PCB

Material: Teflon, ceramic + fr4

Quality standard: IPCB6012 Class2 or Class3

pcb material dielectric constant: 2.2-16

the texture of material: Hybrid pcb, Mixed PCB

Layers: 2layer - multilayer hybrid PCB

Thickness: 0.1mm - 12mm

Copper thickness: 0.5oz - 3oz

Surface technology: Silver, Gold, OSP

Application: High-frequency microwave hybrid PCB

Product Details Data Sheet

Hybrid PCB is usually used in microwave RF series products

With the rapid development of electronic communication technology, in order to achieve high-speed, high fidelity signal transmission, more and more microwave RF PCBs are used in communication equipment. The dielectric materials used in high-frequency hybrid circuit boards have excellent electrical properties and good chemical stability, which are mainly shown in the following four aspects.


1. Hybrid PCB has the characteristics of small-signal transmission loss, short transmission delay time, and small-signal transmission distortion.

2. Excellent dielectric properties (mainly refers to low relative dielectric constant DK, low dielectric loss factor DF). In addition, the dielectric properties (DK, DF) remain stable under the environmental changes of frequency, humidity, and temperature.

3. High precision characteristic impedance control.

4. Hybrid PCB has excellent heat resistance (TG), processability, and adaptability.

FR4+RO3010 Hybrid PCB board

FR4+RO3010 Hybrid PCB board

Microwave high-frequency hybrid PCB is widely used in a wireless antenna, base station receiving antenna, power amplifier, radar system, navigation system, and other communication equipment.


Based on one or more factors of cost-saving, improving bending strength, and electromagnetic interference control, a high-frequency semi-cured sheet with low resin fluidity and FR-4 substrate with smooth medium surface must be used in the laminated design of high-frequency composite laminate. In this case, there is a great risk for the bonding control of products in the pressing process.


Microwave High-frequency hybrid PCB stack manufacturing method and characteristics

1. A kind of high-frequency hybrid PCB controlled depth composite laminate structure, the high-frequency hybrid PCB includes L1 copper layer( high-frequency sheet), L2 copper layer( PP sheet), L3 copper layer( epoxy resin substrate), and L4 copper layer in turn; slot holes with the same size are arranged at the same position on the L2, L3 and L4 copper layer; the L4 copper layer is arranged from the inside Three in one buffer material, steel plate and kraft paper are stacked successively from outside to outside; aluminum sheet, steel plate and kraft paper are successively stacked on the L1 copper layer from inside to outside.
2. According to 1st feature, the three-in-one buffer material is a buffer material sandwiched between two release membranes.

3. According to 1st feature, the laminated structure of the high-frequency plate controlled deep mixing plate is characterized in that the high-frequency sheet material is a polytetrafluoroethylene substrate.

hybrid PCB stackup

hybrid PCB stack up

The expansion and shrinkage characteristics of the high-frequency hybrid PCB composite laminate are different from those of the ordinary epoxy resin substrate, so it is difficult to control the plate curvature and shrinkage, and the processing method of slotting first and then pressing will cause the problem of sheet metal depression. Three in one buffer material is set on one side of the groove, and the buffer material can be filled into the slot hole during pressing, so as to avoid the depression problem. Kraft paper is set on both sides of the board to cushion the pressure and balance Uniform heat transfer, set steel plate to ensure uniform heat conduction in pressing, make the pressing flat, make the heat and pressure balance during pressing, so as to better control the board curvature and expansion and contraction.


With the rapid development of 5G communication technology, more high frequency is required for communication equipment. There are various kinds of microwave high-frequency hybrid PCBs in the market. The manufacturing technology of these microwave high-frequency hybrid PCBs also puts forward higher requirements. With more than 10 years of professional processing iPCB, we can provide multi-layer hybrid PCB manufacturing services, It has all the equipment required for the whole process of multilayer hybrid PCB production, conforming to ISO9001-2000 international standardization management system, and has passed iatf16949 and ISO 14001 system certification. Its products have passed UL certification, and comply with IPC-A-600G and IPC-6012A standards. Can provide high quality, high stability, high adaptability of the microwave high-frequency hybrid PCB samples and batch services.

Product Name: Hybrid PCB

Material: Teflon, ceramic + fr4

Quality standard: IPCB6012 Class2 or Class3

pcb material dielectric constant: 2.2-16

the texture of material: Hybrid pcb, Mixed PCB

Layers: 2layer - multilayer hybrid PCB

Thickness: 0.1mm - 12mm

Copper thickness: 0.5oz - 3oz

Surface technology: Silver, Gold, OSP

Application: High-frequency microwave hybrid PCB


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