Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
PCB News

PCB News - Instructions for purchasing PCB blind buried vias

PCB News

PCB News - Instructions for purchasing PCB blind buried vias

Instructions for purchasing PCB blind buried vias

2021-09-12
View:326
Author:Aure

Instructions for purchasing PCB blind buried vias

With the development of the current portable product design in the direction of miniaturization and high density, PCB board design is becoming more and more difficult, and higher requirements are put forward on the PCB production process. In most of the current portable products, the BGA package with a pitch of less than 0.65mm uses the blind and buried via design process. So what is the blind and buried via? Jedubon will answer for you!

Blind holes are mostly small holes with a diameter of 0.05mm~0.15mm. The buried blind holes are formed by laser hole formation, plasma etching and photo-induced hole formation. Usually laser hole formation is used, and laser hole formation is divided into CO2 and YAG Ultraviolet laser machine (UV).

Blind vias (Blind vias / Laser Vias): Blind vias are vias that connect the inner PCB traces to the PCB surface traces. This hole does not penetrate the entire board.

Buried vias: Buried vias are the type of vias that only connect the traces between the inner layers, so they are invisible from the surface of the PCB.


Blind and buried via circuit boards, also called HDI boards, are often used in high-end products such as mobile phones, GPS navigation, etc. The structure of conventional multilayer circuit boards contains inner and outer circuits, and then uses drilling holes., And the process of metallization in the hole to realize the connection function between the inside of each layer of the circuit. Next, let's learn about its precautions and maintenance.

Instructions for purchasing PCB blind buried vias


Precautions

If you want to copy the blind and buried via circuit board, it is more difficult. Generally, when copying the board on the mobile phone board and HDI board, you will encounter blind and buried vias, so pay attention to the following:

1. Be careful and make preparations before copying the board;

2. The equipment must be advanced;

3. In the process of copying the board, it must be constantly compared with the original board;

4. Pay attention to the inspection and repeat the inspection many times.

Blind and buried via maintenance

In order to ensure the good working condition of the blind and buried vias circuit board and reduce the failure rate of the circuit board, the circuit board should be maintained, including annual maintenance and semi-maintenance. The maintenance methods are as follows:

1. Annual maintenance of blind and buried holes

(1) Regularly check the capacity of the electrolytic capacitor in the circuit board. When it is found that the capacity of the electrolytic capacitor is less than 20% of the nominal capacity, it should be replaced in time; in general, the working life of the electrolytic capacitor is about 10 years, so to ensure For the normal operation of the circuit board, all electrolytic capacitors should be replaced in about 10 years;

(2) For high-power devices coated with heat-dissipating grease, check whether the heat-dissipating grease is dry or not. For dry heat-dissipating grease, remove the dry heat-dissipating grease and apply new heat-dissipating grease to prevent wiring The high-power devices in the board burn out due to poor heat dissipation;

(3) Clean the dust on the circuit board in time to ensure that the circuit board is clean.

2. Semi-maintenance for blind buried holes

(1) Clean up the dust on the circuit board quarterly. Use the special cleaning fluid for the circuit board to clean it. After cleaning the dust on the circuit board, use a blower to dry the circuit board;

(2) Observe whether the electronic components in the circuit board have undergone high temperature traces, and whether the electrolytic capacitors have bulged and leaked, and they should be replaced if any.

With the development of electronic products to high density and high precision, the same requirements are put forward for the blind and buried circuit boards. Of course, some matters must be paid attention to, and at the same time, it must be maintained to ensure the usability of the blind and buried circuit boards. ipcb is a high-precision, high-quality PCB manufacturer, such as: isola 370hr PCB, high-frequency PCB, high-speed PCB, ic substrate, ic test board, impedance PCB, HDI PCB, Rigid-Flex PCB, buried blind PCB, advanced PCB, microwave PCB, telfon PCB and other ipcb are good at PCB manufacturing.