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PCB Proofing Integrated System PCB Board Design New Technology
PCB News
PCB Proofing Integrated System PCB Board Design New Technology

PCB Proofing Integrated System PCB Board Design New Technology


The current electronic design of PCB proofing is mostly integrated system-level design, and the whole project includes both hardware design and software development. This technical feature poses new challenges to electronic engineers.

First of all, how to divide the system's software and hardware functions reasonably in the early design stage to form an effective functional structure framework to avoid redundant cyclic processes;
Secondly, how to design a high-performance and high-reliability PCB board in a short time. Because the development of software relies heavily on the realization of hardware, only by ensuring that the whole machine design is passed once can the design cycle be shortened more effectively. This article discusses the new features and new strategies of system board-level design under the new technical background.


As we all know, the development of electronic technology is changing with each passing day, and the root cause of this change is the progress of chip technology. The semiconductor process is becoming increasingly physical, and has now reached the deep sub-micron level, and ultra-large-scale circuits have become the mainstream of chip development. And this change in process and scale has brought many new electronic design bottlenecks throughout the entire electronics industry. The board-level design has also been greatly impacted. The most obvious change is that the types of chip packaging are extremely rich, such as the emergence of BGA, TQFP, PLCC and other packaging types; secondly, high-density pin packaging and miniaturized packaging have become one. This kind of fashion, in order to realize the miniaturization of the whole product, such as: the wide application of MCM technology. In addition, the increase in the operating frequency of the chip makes it possible to increase the operating frequency of the system. These changes will inevitably bring many problems and challenges to board-level design. First, due to the increasing physical limits of high-density pins and pin sizes, resulting in low deployment rates; secondly, the timing and signal integrity problems caused by the increase in system clock frequency; thirdly, engineers hope to be able to use the PC platform Use better tools to complete complex and high-performance designs. Therefore, it is not difficult for us to see that PCB board design has the following three trends:

The design of high-speed digital circuits (that is, high clock frequency and fast edges) has become the mainstream.
Product miniaturization and high performance must face the problem of distribution effects caused by mixed-signal design technology (ie, digital, analog, and RF mixed design) on the same board.
The increase in design difficulty has led to traditional design processes and design methods, as well as PC CAD tools that are difficult to meet the current technical challenges. Therefore, the transfer of EDA software tool platform from UNIX to NT platform has become a recognized trend in the industry.

The above is the introduction of the new technology of integrated system PCB board design for pPCB proofing. Ipcb also provides PCB manufacturers and PCB manufacturing technology.