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PCB Tech

PCB Tech

PCB Tech

PCB Tech

What is ESC technology
2021-10-03
View:33
Author:Frank

What is ESC technology
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
Technological innovation is constantly evolving and changing. For example, in SMT chip processing, in addition to the most common PCB circuit board chip processing methods and printed solder paste through reflow soldering, we also have many things based on product characteristics. Special processes, such as SMT, DIP plug-in, etc., where ESC is also a welding process.


ESC (Epoxy Sealed Solder Connection) technology is an epoxy resin sealed soldering method that uses a new type of resin wrapped solder to heat the connection. ESC technology is a new technology to replace ACF, which can simplify the process and reduce costs.

 

1. ESC technical process

 

pcb board

First, apply the solder paste resin glue to the pads of the hard board, then align and fix the electrodes of the soft board to the pads of the hard board, and finally achieve soldering and resin curing by heating and pressing at the same time.

2. Comparison of ESC and ACF technology

Because ACF technology has some defects in handling and connection strength. The process of ACF is more complicated than that of ESC. Compared with ACF, ESC has the following advantages:

①The process is simple, saving the space for sticking ACF tape;

②Welding + resin curing, strengthen the connection arc, and improve the reliability;

③More application areas.

3. Application of ESC technology

① The new development of flip chip assembly process. ESC technology can realize flip chip reflow soldering and underfill curing.

②MM-ESC technology (module and module combination technology).

③The bonding technology between the new generation mobile phone connectorless substrates

The use of ESC technology can realize the connectorless connection between the 5 modules of the new generation of mobile electronic languages, thereby saving space, reducing the thickness of the machine, and improving the connection strength and reliability.
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