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PCB Tech
Poor surface quality during pcb circuit board processing
PCB Tech
Poor surface quality during pcb circuit board processing

Poor surface quality during pcb circuit board processing

2021-10-18
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Author:Aure

Poor surface quality during pcb circuit board processing


  What are the 4 situations that may cause poor board quality during the processing of pcb circuit boards?

  1. The problem of substrate process processing: especially for some thin substrates (generally below 0.8mm), because the rigidity of the substrate is poor, it is not suitable to use a brushing machine to brush the board. This may not be able to effectively remove the protective layer specially treated to prevent the oxidation of the copper foil on the board surface during the production and processing of the substrate. Although the layer is thin and the brush is easier to remove, it is more difficult to use chemical treatment, so in production It is important to pay attention to control during processing, so as to avoid the problem of blistering on the board caused by the poor bonding between the copper foil of the board substrate and the chemical copper; this kind of problem will also cause blackening and browning when the thin inner layer is blackened. Poor, uneven color, partial black browning and other problems.

  2. The phenomenon of poor surface treatment caused by oil stains or other liquids contaminated with dust during the machining (drilling, lamination, milling, etc.) of the board surface.


pcb circuit board processing



3. Poor sinking copper brush plate: the pressure of the sinking copper front grinding plate is too large, causing the orifice to be deformed, brushing out the copper foil rounded corners of the orifice or even leaking the substrate, which will cause the sinking copper electroplating, spraying tin welding and other processes. Foaming phenomenon at the orifice; even if the brush plate does not cause leakage of the substrate, the excessively heavy brush plate will increase the roughness of the orifice copper, so during the process of microetching and roughening, the copper foil at this place is very easy to cause excessive roughening. , There will also be certain quality hidden dangers; therefore, it is necessary to strengthen the control of the brushing process, and the brushing process parameters can be adjusted to the best through the wear scar test and the water film test.

4. Water washing problem: Because the electroplating treatment of copper sinking has to go through a lot of chemical treatment, there are many kinds of acid, alkali and organic solvents. At the same time, it will also cause poor partial treatment of the board surface or poor treatment effect, uneven defects, and cause some binding problems; therefore, attention should be paid to strengthening the control of washing, mainly including the flow of washing water, water quality, and washing time , And the control of the dripping time of the panel; especially in winter, the temperature is lower, the washing effect will be greatly reduced, and more attention should be paid to the strong control of the washing;

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