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PCB Tech

PCB Tech

PCB Tech

PCB Tech

Common printed circuit board standards

1) IPC-ESD-2020

Joint standard for electrostatic discharge control program development. It includes the design, establishment, implementation and maintenance of ESD control program. According to the historical experience of some military and commercial organizations, this paper provides guidance for the treatment and protection of ESD in sensitive period.

2) IPC-SA-61A

Manual for cleaning after welding. It includes all aspects of semi aqueous cleaning, including chemical and production residues, equipment, process, process control, environmental and safety considerations.

3) IPC-AC-62A

Manual for cleaning after welding. Describe manufacturing residues, types and properties of aqueous cleaning agents, process, equipment and process, quality control, environmental control and employee safety, and the cost of measurement and determination of cleanliness.

4) IPC-DRM-40E

Desktop reference manual for through hole solder joint evaluation. According to the requirements of the standard, the detailed description of components, hole wall and welding surface coverage, in addition to this, it also includes computer generated 3D graphics. It covers tin filling, contact angle, tin dipping, vertical filling, pad covering and a large number of defects in welding points.

5) IPC-TA-722

Welding technology assessment manual. It includes 45 articles on various aspects of welding technology, including general welding, welding materials, manual welding, batch welding, wave soldering, reflow welding, gas phase welding and infrared welding.

6) IPC-7525

Template design guidelines. It provides guidelines for the design and manufacture of solder paste and surface mount adhesive coated templates. I also discuss the template design using surface mount technology, and introduce the "through-hole" or "flip chip" components? Kunhe technology includes overprint, double printing and stage template design.


Flux specification requirements I include Appendix I. It includes technical index and classification of rosin and resin, organic and inorganic fluxes classified according to the content and activation degree of halide in flux; it also includes the use of flux, substances containing flux and low residual flux used in no cleaning process.


The specification requirements of solder paste I include Appendix I. The characteristics and technical requirements of solder paste are listed, including test methods and standards of metal content, as well as viscosity, collapse, solder balls, stickiness and tin staining properties of solder paste.


Specification requirements for electronic grade solder alloys, flux and non flux solid solder. For electronic grade solder alloy, for rod, strip, powder flux and non flux solder, for the application of electronic solder, provide nomenclature, specification requirements and test methods for special electronic grade solder.

10) IPC-Ca-821

General requirements for thermal conductive binders. This includes requirements and test methods for thermal conductive dielectrics that bond components to appropriate locations.

11) IPC-3406

Guide for applying adhesives to conductive surfaces. In electronic manufacturing, it provides guidance for the selection of conductive binder as an alternative for soldering tin.

12) IPC-AJ-820

Assembly and welding manual. It includes the description of inspection technology for assembly and welding, including terms and definitions; printed circuit board, component and pin type, solder joint material, component installation and design specification reference and outline; welding technology and packaging; cleaning and coating; quality assurance and testing.

13) IPC-7530

Guide for temperature curves of batch welding processes (reflow and wave soldering). In the temperature curve acquisition, various testing methods, techniques and methods are used to provide guidance for the establishment of graphs.

14) IPC-TR-460A

PCB wave soldering troubleshooting list. A list of recommended corrective actions for failures that may be caused by wave soldering.


Solderability test of printed circuit board.

16) J-STD-013

Ball foot grid array packaging (SGA) and other high-density technology applications. The specification requirements and interactions required for PCB packaging process are established to provide information for high performance and high pin number IC package interconnection, including design principle information, material selection, board manufacturing and assembly technology, test method and reliability expectation based on end use environment.

17) IPC-7095

SGA device design and assembly process supplement. It provides various useful operational information for those who are using SGA devices or considering switching to array packaging; provides guidance for the inspection and maintenance of SGA and provides reliable information about the field of SGA.

18) IPC-M-I08

Cleaning instruction manual. Includes version of IPC cleaning instructions to assist manufacturing engineers in determining product cleaning process and troubleshooting.

19) IPC-CH-65-A

Guidelines for cleaning printed circuit board assembly. It provides a reference for the current and emerging cleaning methods in the electronic industry, including the description and discussion of various cleaning methods, and explains the relationship between various materials, processes and pollutants in the manufacturing and assembly operations.

20) IPC-SC-60A

Cleaning manual for solvent after welding. The application of solvent cleaning technology in automatic welding and manual welding is given. The properties of solvent, residue, process control and environmental problems are discussed.

21) IPC-9201

Surface insulation resistance manual. It includes the terminology, theory, testing process and means of surface insulation resistance (SIR), as well as temperature and humidity (th) test, fault mode and troubleshooting.

22) IPC-DRM-53

Introduction to electronic assembly desktop reference manual. Illustrations and photographs illustrating through hole mounting and surface mount assembly techniques.

23) IPC-M-103

SMT assembly manual standard. This section includes all 21 IPC documents related to surface mount.

24) IPC-M-I04

Standard for printed circuit board assembly manual. Contains 10 widely used documents on printed circuit board assembly.

25) IPC-CC-830B

Performance and identification of electronic insulating compounds in printed circuit board assembly. The shape protecting coating meets an industry standard of quality and qualification.

26) IPC-S-816

Process guide and list of surface mount technology. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, solder leakage, uneven placement of components, etc.

27) IPC-CM-770D

Installation guide for printed circuit board components. It provides effective guidance for the preparation of components in PCB assembly, and reviews the relevant standards, influence and distribution, including assembly technology (manual and automatic, surface mount technology and flip chip assembly technology) and consideration of subsequent welding, cleaning and coating process.

28) IPC-7129

The number of failures per million chance (DPMO) calculation and PCB assembly manufacturing indicators. It provides a satisfactory method for calculating the benchmark of the number of failures per million opportunities.

29) IPC-9261

The output estimation of PCB assembly and the failure rate per million chance in the process of assembly. This paper defines a reliable method to calculate the number of failures per million opportunities in the process of PCB assembly, which is the evaluation standard of each stage in the assembly process.

30) IPC-D-279

Reliable surface mount technology PCB assembly design guide. Reliability manufacturing process guide for printed circuit boards with surface mount technology and hybrid technology, including design ideas.

31) IPC-2546

The combination requirements of transmission points in PCB assembly. Material movement systems such as actuators and buffers, manual placement, automatic screen printing, automatic binder distribution, automatic surface mount placement, automatic plating through-hole placement, forced convection, infrared reflow furnace and wave soldering are described.

32) IPC-PE-740A

Troubleshooting in PCB manufacturing and assembly. It includes the record and correction activities of problems in the process of design, manufacturing, assembly and testing of printed circuit products.

33) IPC-6010

Series of quality standards and performance specifications for printed circuit boards. This includes the quality standards and performance specifications of all printed circuit boards developed by the American printed circuit board Association.

34) IPC-6018A

Inspection and test of microwave printed circuit board. Including the performance and qualification requirements of high frequency (microwave) printed circuit boards.

35) IPC-D-317A

Design guidelines for electronic packaging using high speed technology. Provide guidance for high speed circuit design, including mechanical and electrical considerations and performance testing.