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PCB Tech - What is the qualification standard for pcb copy board?

PCB Tech

PCB Tech - What is the qualification standard for pcb copy board?

What is the qualification standard for pcb copy board?

2021-10-23
View:392
Author:Downs

Qualified standards for PCB copy board:

One, part:

1. Disconnect,

A, there is a break or discontinuity on the line,

B. The cable length exceeds 10mm and cannot be repaired.

C. The disconnection is located near the pad or edge of the hole (The circuit breaker is less than or equal to 2mm and can be repaired at the pad or edge.) The distance between the circuit breaker and the pad or flange is greater than 2mm and cannot be repaired.)

D. Adjacent lines cannot be repaired by side disconnection.

E. The line gap is disconnected at the turn (the circuit breaker is less than or equal to 2mm at the turning distance and can be repaired. The circuit at the turn is greater than 2 mm and cannot be repaired.)

2. Short circuit,

A. There is a short circuit caused by a foreign object between the two wires, which can be repaired.

pcb board

B. The inner short circuit cannot be repaired.

3. Line gap,

A. The line gap is not 20% of the original line width and can be repaired.

4. Line SAG and indentation,

A. The line is uneven and the line pressure drops, which can be repaired.

5. The thread is dyed with tin,

A, wire dip tin, (the total area of tin is less than or equal to mm2, can be repaired, the tin area is greater than mm2

unavailable.

6, poor line maintenance,

A, Complement code offset or complement code specification does not meet the original line size (does not affect the minimum width or spacing)

7, the wire is exposed to copper,

A, PCB solder wire can be repaired

8, the line is crooked,

A, the spacing is smaller than the original spacing or there are notches, which can be repaired

9, stripping,

A. There is a peeling phenomenon between the copper layer and the copper layer, which cannot be repaired.

10. Insufficient line spacing,

A, the reduction of the double-line spacing cannot exceed 30%. Repairable, more than 30% cannot be repaired.

11. Copper slag,

A, the distance between the two lines should not be reduced by more than 30%, it can be repaired,

B. Two-wire components are reduced by more than 30% and cannot be repaired.

12. Line pollution and oxidation,

A. Some lines are discolored and darkened due to oxidation or pollution, and no maintenance is required.

13, underline,

A. The scratch line caused by copper can be repaired, regardless of whether the copper is scratched.

14, thin lines,

A. The PCB line width is less than 20% of the specified line width and cannot be repaired.

Second, the solder mask part:

1. Color difference (standard: upper and lower level),

A. The color of the printing plate ink is different from the standard color. When it is determined that it is not within the allowable range, it can be controlled by the color difference table

2. Anti-welding cavitation;

3. Anti-welding exposed copper;

A, Green paint can be repaired by stripping copper.

4. Resistance to welding scars;

A, can repair solder resistance caused by scratches caused by copper or seeing the substrate

5. Solder protection on the pad,

A. The tin pad, BGA pad and ict pad dyed with ink cannot be repaired.

6. Poor repair: the green paint coating area is too large or incomplete to repair, the length is greater than 30mm, the area is greater than 10mm2, and the circle is greater than 7mm2 in diameter; not allowed.

7. Contaminated by foreign objects;

A. There are other foreign objects scattered in the solder mask interlayer. It can be repaired.

8 The ink is uneven;

A. Ink or unevenness on the board surface affects the appearance, and local slight ink accumulation does not need to be repaired.

9.BGA Viahol Ink;

A, BGA requires 100% ink insertion,

10.CARD bus through hole to insert ink

A, The through hole of the CARD BUS connector requires 100% plug. The inspection method is opaque under backlight.

11. The VIA hole is not blocked;

A, VIA holes need to be 95% cold, and the hole inspection mode is backlit and opaque

12. Tin: no more than 30mm2

13. Pseudo exposed copper; can be repaired

14. Wrong use of ink color; non-maintenance

three. PCB perforation part;

1, Conce,

A. Part holes in foreign objects caused by the inaccessibility of parts holes cannot be repaired.

2. Make holes,

A. The upper and lower holes caused by broken holes cannot be repaired.

B, the hole cannot be repaired.

3. Holes inside the green paint,

A, the part hole is solder resist, white paint residue cover, non-maintenance

4. npth, tin in the hole

A, Npth holes made of PHT holes can be repaired.

5. Kondo Lock, not applicable

6. Leak hole lock, not repaired.

7. Hole deflection, hole offset pad, not repaired.

8, big holes, small holes,

A, Condacon is smaller than the specification error. unavailable.

9, BGA through hole Concecy, not repairable.

Fourth, the text part:

1. Text offset, text offset, paint tin pad. unavailable.

2. The text color does not match, and the text color printing is wrong.

3. Text replay, text shadow can be recognized and repaired,

4. Text leaks, text leaks cannot be repaired.

5. Text ink dyed board surface, text ink dyed board surface, repairable,

6. The text is unclear, and the text is not clear, which affects the identification. It can be repaired.

7. The text is dropped, there is a 3m600 tape to do a tensile test, the text