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PCB multi-layer circuit board processing technology type
PCB News
PCB multi-layer circuit board processing technology type

PCB multi-layer circuit board processing technology type

2021-11-11
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Author:Kavie

PCB multi-layer circuit board processing technology type


PCB

   The surface treatment methods used by circuit board factories are different. Each surface treatment method has its own unique characteristics. Taking chemical silver as an example, its process is extremely simple. It is recommended for lead-free soldering and smt use, especially for fine The circuit effect is better, and the most important thing is to use chemical silver for surface treatment, which will greatly reduce the overall cost and lower the cost. The classification of PCB multi-layer circuit boards can be divided into many process types. Let's introduce the types of PCB multi-layer circuit board processing processes:




Surface technology: hot air leveling (HAL), gold finger, lead-free tin spraying (Lead free), chemical (immersion) gold, silver/tin, anti-oxidation treatment (OSP), rosin treatment, etc.


Reliability test: open/short circuit test, impedance test, solderability test, thermal shock test, metallographic microsection analysis, etc.


Solder mask color: green, black, blue, white, yellow, red, etc.


Character color: white, yellow, black, etc.


Gold-plated plate: thickness of nickel layer:> or = 5μ


Spray tin plate: tin layer thickness: >or=2.5-5μ


V cut: Angle: 30 degrees, 35 degrees, 45 degrees   depth: plate thickness 2/3


Special process: blind buried via, HDI, carbon oil filling hole, gold finger, BGA, module board, main board, etc.

The above is an introduction to the types of PCB multi-layer circuit board processing technology. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology