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Vacuum static condensation reflow soldering of smt equipment
Vacuum static condensation reflow soldering of smt equipment

Vacuum static condensation reflow soldering of smt equipment


The vacuum static condensation welding equipment has a function, that is, it can realize the function of manual intervention during the welding process, allowing the user to adjust the welding parameters during the smt patch welding process, and the welding process can be changed according to the temperature required by the user. This is undoubtedly good news for products with many varieties and small batches, because the equipment not only allows us to manually control the temperature changes inside the welding chamber in real time, but also allows us to see the entire process of product welding through the camera. There are five K-type thermocouples in the warehouse that will transmit the temperature changes of the solder joints to the display in real time, allowing us to analyze and judge, so that we can make real-time judgments and manual interventions on the customer’s single experimental product based on sufficient data. Get perfect solder joints.

For special CBGA, LCCC and other ceramics (the solder balls are 90PblOSn alloy) high-lead solder joints and products with shells,

pcb board

including micro-assembled shell-and-tube products, vacuum static condensation reflow soldering equipment has great advantages. The high-reliability soldering of batch products can be completed within 6 minutes, and the soldering quality far exceeds the hot air reflow soldering and vacuum eutectic sintering furnace commonly used by customers. It is the 21st century cutting-edge reflow soldering technology.

1. Advantages of vacuum static condensation reflow soldering equipment

It can effectively solve the aforementioned process bottleneck problem, reduce the formation of welding defects, and improve the quality of welding products. Here is an introduction to its advantages.

The main advantages are:

1) Using static vacuum condensing reflow soldering process to reduce voids and solder joint micro-cracks;

2) Avoid secondary oxidation of solder, improve solder spreading power and solder wetting ability;

3) Welding in a static environment can effectively avoid poor solder joints and component displacement caused by external forces;

4) Effectively control the temperature curve, the temperature is consistent in any part of the product, and there is no problem of false temperature curve;

5) Limit the maximum temperature and avoid the problem of excessively high local soldering temperature of thermal components;

6) Reduce the problems of splashing tin beads and surface pollution;

7) It can be adapted to solder with various solders.

8) The contaminants of the flux are cleaned up in time, and no excess waste gas, waste liquid, and waste slag will be generated.

9) In the process of smt patch proofing or processing and production, real-time monitoring and real-time manual intervention of the welding process can be performed, and the entire welding process is controllable.

10) The maximum processing size can reach 800*800mm, and the product height can reach 120mm.

2. The development of vacuum static condensation reflow soldering

Because of the good heat transfer characteristics of vacuum static condensation reflow soldering, it is most suitable for soldering large-volume assembly parts that are difficult to heat treatment. For lead-free soldering with a narrow process window, vacuum static condensation reflow soldering is an ideal process. The new development of vacuum static condensation reflow technology has improved the flexibility of the process and reduced operating costs. Nowadays, European and American military companies generally use vacuum static condensation reflow soldering equipment to solder their products. The life and reliability of military electronic PCB products can meet the increasingly demanding requirements.