PCB Tech - The difference between PCB proofing and board making

The difference between PCB proofing and board making

PCB proofing refers to the trial production of printed circuit boards before mass production. Generally, electronic products are sent to the PCB manufacturer to be processed into PCB boards after the engineer's design is completed. The update iteration of electronic products is relatively fast, so the demand for PCB proofing is gradually growing, and the market share is constantly expanding. As the technological requirements of electronic products are getting higher and higher, the information is getting faster and faster, leading to multi-layer PCB proofing The rise is relatively fast.

1. There are two ways of proofing: a regular PCB factory and a dedicated model company. In your situation, it is more suitable to find a proofing company. They live by charging for proofing and will definitely accept your request for only two items.

2. The purpose of the formal factory proofing is to have bulk orders, so of course I hope to return the order; the proofing company itself only makes prototypes or small batches, and he can't do it if you have a large order for him.

3. In terms of quality assurance, the regular factory is definitely better than the model company. The model company is a one-shot deal and the model will be charged as soon as the sample is sent. You don't need to do the flying probe test. If the quality is not enough, you have to call it again. Money; regular factories usually do flying probe tests, and they are careful in materials and processes, so the quality often succeeds in one shot.

What are the factors that affect the quality of electroplating in the PCB electroplating process

In the PCB electroplating process, the main salt refers to the salt that can deposit the required plating metal on the cathode in the plating solution, and is used to provide metal ions. The main salt concentration in the bath must be in an appropriate range, and the main salt concentration increases

In some cases, if the metal ions of the main salt in the plating solution are simple ions, the plating grains will be coarse. Therefore, a complex ion plating solution should be used. The method to obtain complex ions is to add a complexing agent, that is, a substance that can complex the metal ions of the main salt to form a complex. A complex is a "molecular compound" formed by the interaction of simple compounds. In the plating bath containing complexes, the main influence on the electroplating effect is the relative content of the main salt and the complexing agent, that is, the free amount of the complexing agent, rather than the absolute content.

"Buffer" refers to a substance used to stabilize the pH of a solution. Such substances are generally composed of weak acids and weak acid salts or weak bases and weak base salts, which can reduce the pH value of the solution when it encounters alkali or acid.

Additives refer to substances that do not significantly change the conductivity of the coating, but can significantly improve the performance of the coating. According to the role played in the bath, additives can be divided into: brightener, leveling agent, and fog suppressant.

The substance in the plating solution that can promote the activation of the anode is called the anode activator. The function of the anode activator is to increase the current density at which the anode begins to passivate, so as to ensure that the anode is in an activated state and can be dissolved normally. When the anode activator content is insufficient, the anode dissolves abnormally, and the content of the main salt decreases rapidly, which affects the stability of the plating solution. In severe cases, electroplating cannot be performed normally.

Factors affecting the quality of electroplating

Plating can be electroplated with different metals, such as zinc plating, nickel plating, chrome plating, etc.

PH value, additives, current density, current waveform, temperature, stirring speed, etc.

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