PCB Tech - PCB board metallization edge: gold finger technology

The invention relates to the field of PCB board manufacturing, and in particular to a process of plating the side of the PCB board with gold and electroplating nickel and gold. With the development of the industry, more and more electronic products have begun to use the bonding process to minimize the product volume, so more and more PCBs use the electroplated nickel gold surface process.
In the mainstream production process, the gold-plated finger process can realize the gold-cladding of the solder joints, but it is necessary to separately make the lead-through solder joints and the board edges, which are removed after gold plating. It is only suitable for the production of gold-clad solder joints on the side of the board. ; The production process of electroplating nickel gold is simple, and there is no need to make the leads separately, but only the top layer of the solder joints can be plated with gold, and the plate side gold can not be produced.

Technical realization elements:
The invention provides a PCB board side gold-clad nickel-gold electroplating process, which can simultaneously realize top layer gold plating and board side gold-cladding.
In order to solve the above problems, as an aspect of the present invention, there is provided a gold-clad nickel-gold electroplating process on the side of a circuit board, which includes forming an etching groove on the copper surface of the circuit board by etching, and the etching groove The gold-clad pattern on the edge of the board is extended so that the sidewalls of the copper layer that need to be coated with gold are exposed; a dry film is pasted on the copper layer, and a window is formed on the dry film, and the window corresponds to the The etching groove and the copper plate area that needs to be coated with gold are arranged and exposed the side wall; the PCB board is electroplated with nickel and gold, so that the copper plate area and the side wall are plated with a layer Nickel gold.

Detailed ways
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
In one aspect of the present invention, there is provided a gold-clad nickel-gold electroplating process on the side of a PCB board. The pattern extends to expose the sidewalls 3 of the copper layer 2 that need to be coated with gold; a dry film 4 is pasted on the copper layer 2, and an opening 6 is formed on the dry film 4, and the opening corresponds to The etching groove 1 and the copper plate area 5 that needs to be coated with gold are arranged and expose the side wall; the circuit board is electroplated with nickel and gold, so that the copper plate area 5 and the side wall 3 Both are plated with a layer of nickel and gold.
When making a circuit board, firstly, as shown in Figure 1, a dry film 9 is pasted on the outer side wall of the copper layer 2, and an opening 8 is formed on the dry film 9, and the opening 8 corresponds to the to-be-formed Etch groove 1 and correspond to its shape. Then, etching is performed, thereby forming the etching groove 1. Among them, one side wall 3 of the etching groove 1 is the side wall that needs to be side-clad with gold in the subsequent process.
Then, a dry film 4 is pasted on the outer wall of the copper layer 2, and at the same time, the dry film 4 is formed with an opening corresponding to the copper plate area 5 to be gold-plated and gold-clad on the side of the board and the etching groove 1 around it. 6.
Finally, electroplating the PCB board. Since the upper surface and side surfaces of the copper plate area 5 are not covered with the dry film 4 at this time, nickel and gold can be formed on the upper surface and sidewalls of the copper plate area 5 at the same time during electroplating, so as to achieve top layer gold plating and board edge gold plating at the same time.