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Introduction to common standards in printed circuit boards

Industry Standard Industry
  1) IPC-ESD-2020: A joint standard for the development of electrostatic discharge control procedures. Including the necessary design, establishment, implementation and maintenance of electrostatic discharge control procedures. Based on the historical experience of certain military organizations and commercial organizations, it provides guidance for handling and protection during sensitive periods of electrostatic discharge.

  2) IPC-SA-61 A: Semi-aqueous cleaning manual after welding. Including all aspects of semi-aqueous cleaning, including chemical, production residues, equipment,pcb technology, process control, and environmental and safety considerations.

  3) IPC-AC-62A: Water into the cleaning manual after welding. Describe the cost of manufacturing residues, the types and properties of aqueous cleaning agents, the process of aqueous cleaning, equipment and techniques, quality control, environmental control, employee safety, and cleanliness measurement and measurement.

  4) IPC-DRM -4 0E: Through-hole solder joint evaluation desktop reference manual. Detailed description of components, hole walls and welding surface coverage according to standard requirements, in addition to computer-generated 3D graphics. Covers tin filling, contact angle, tin dip, vertical filling, solder pad coverage, and numerous solder joint defects.

  5) IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.

  6) IPC-7525: Template Design Guidelines. Provide guidelines for the design and manufacture of solder paste and surface mount adhesive coating templates i Also discussed template design using surface mount technology, and introduced the use of through-hole or flip chip components? Technology, including overprinting, double printing and staged template design.

pcb board

  7) IPC/EIA J-STD-004: Specification requirements for flux include Appendix I. Contains technical indicators and classifications of rosin, resin, etc., organic and inorganic fluxes classified according to the halide content and activation degree in the flux; also includes the use of flux, the substance containing flux, and the low level used in the no-clean process. Flux residue.

   8) IPC/EIA J-STD -005: Specification requirements for solder paste include Appendix I. Lists the characteristics and technical index requirements of solder paste, including test methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and solder paste wetting performance.

  9) IPC/EIA J-STD-0 06A: Specification requirements for electronic grade solder alloy, flux and non-flux solid solder. For electronic grade solder alloys, rod-shaped, strip-shaped, powdered flux and non-flux solder, for the application of electronic solder, and provide term naming, specification requirements and test methods for special electronic-grade solder.

  10) IPC-Ca-821: General requirements for thermally conductive adhesives. Including the requirements and test methods for thermally conductive dielectrics to bond components to appropriate locations.

  11) IPC-3406: Guidelines for Coating Adhesives on Conductive Surfaces. Provide guidance for the selection of conductive adhesives as solder alternatives in electronic manufacturing.

  12) IPC-AJ-820: Assembly and welding manual. Contains a description of assembly and welding inspection technology, including terms and definitions; printed circuit boards, components and pin types, solder joint materials, component installation, design specifications and outlines; soldering technology and packaging; Cleaning and laminating; quality assurance and testing.

  13) IPC-7530: Temperature curve guide for batch soldering process (reflow soldering and wave soldering). Various test methods, techniques and methods are used in the acquisition of the temperature curve to provide guidance for establishing the best graph.

  14) IPC-TR-460A: Printed circuit board wave soldering troubleshooting checklist. A list of recommended corrective actions for failures that may be caused by wave soldering.

  15) IPC/EIA/JEDEC J-STD-003A. Solderability test of printed circuit boards.

  16) J-STD-0 13: Ball grid dot array package (SGA) and other high-density technology applications. Establish the specification requirements and interactions required for the printed circuit board packaging process, and provide information for the interconnection of high-performance and high-pin-count integrated circuit packaging, including design principle information, material selection, board manufacturing and assembly technology, and test methods And reliability expectations based on the end-use environment.

  17) IPC-7095: Supplement to the design and assembly process of SGA devices. Provide a variety of useful operating information for people who are using SGA devices or considering switching to the field of array packaging; provide guidance for SGA inspection and maintenance and provide reliable information about the SGA field.

  18) IPC-M-I08: Cleaning instruction manual. Includes the latest version of IPC cleaning instructions to help manufacturing engineers when deciding on product cleaning procedures and troubleshooting.

IPC-CH-65-A: Cleaning Guidelines in Printed Circuit Board Assembly Question #e#19) IPC-CH-65-A: Cleaning Guidelines in Printed Circuit Board Assembly. It provides reference for the current and emerging cleaning methods in the electronics industry, including the description and discussion of various cleaning methods, and explains the relationship between various materials, processes and contaminants in manufacturing and assembly operations.

  20) IPC-SC-60A: Manual of solvent cleaning after soldering. The use of solvent cleaning technology in automatic welding and manual welding is given, and the nature of solvents, residues, process control and environmental issues are discussed.

  21) IPC-9201: Surface Insulation Resistance Handbook. Contains the terminology, theory, test process and test methods of surface insulation resistance (SIR), as well as temperature and humidity (TH) testing, failure modes and troubleshooting.

  22) IPC-DRM-53: Introduction to Electronic Assembly Desktop Reference Manual. Diagrams and photos used to illustrate through-hole mounting and surface-mount assembly technology.

  23) IPC-M-103: Surface mount assembly manual standard. This section includes all 21 IPC files related to surface mount.

  24) IPC-M-I04: Printed circuit board assembly manual standard. Contains the 10 most widely used documents related to printed circuit board assembly.

  25) IPC-CC-830B: Performance and identification of electronic insulating compounds in printed circuit board assembly. The protective coating meets an industry standard for quality and qualification.

  26) IPC-S-816: Surface Mount Technology Process Guide and List. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and uneven placement of components.

  27) IPC-CM-770D: Printed circuit board component installation guide. Provide effective guidance for the preparation of components in printed circuit board assembly, and review relevant standards, influence and distribution, including assembly technology (including manual and automatic, surface mount technology and flip chip assembly technology ) And consideration of subsequent welding, cleaning and coating processes.

  28) IPC-7129: Calculation of the number of failures per million opportunities (DPMO) and printed circuit board assembly manufacturing indicators. It is a benchmark index that is unanimously agreed by relevant industrial departments for calculating defects and quality; it provides a satisfactory method for calculating the benchmark index of the number of failures per million opportunities.

  29) IPC-9261: Estimated output of printed circuit board assemblies and failures per million opportunities during assembly. It defines a reliable method to calculate the number of failures per million opportunities in the process of printed circuit board assembly, and is a measurement standard for evaluation at each stage of the assembly process.

  30) IPC-D-279: Reliable surface mount technology printed circuit board assembly design guide. Reliability manufacturing process guide for printed circuit boards of surface mount technology and hybrid technology, including design ideas.

  31) IPC-2546: Combination requirements for conveying key points in printed circuit board assembly. Describes material movement systems such as actuators and buffers, manual placement, automatic screen printing, automatic adhesive dispensing, automatic surface mount placement, automatic plated through hole placement, forced convection, infrared reflow oven, and wave soldering.
  32) IPC-PE-740A: Troubleshooting in the manufacture and assembly of printed circuit boards. Including printed circuit products in the design, manufacturing, assembly and testing process of problems in case records and correction activities.
  33) IPC-6010: Printed circuit board quality standard and performance specification series manual. Including the quality standards and performance specifications established by the American Printed Circuit Board Association for all printed circuit boards.
  34) IPC-6018A: Inspection and testing of microwave finished printed circuit boards. Including the performance and qualification requirements of high-frequency (microwave) printed circuit boards.