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pcba processing technology

The PCBA process is a combination of SMT manufacturing process and DIP manufacturing process. According to the requirements of different production technologies, it can be divided into single-sided SMT mounting manufacturing process, single-sided DIP insertion manufacturing process, single-sided hybrid packaging process, single-sided hybrid packaging process, double-sided SMT mounting process and double-sided hybrid packaging process Wait.

The PCBA process involves processes such as carrier board, printing, installation, reflow soldering, plug-in, wave soldering, testing and quality inspection.

printed circuit board bare board

1. Single-sided SMT mounting

Add solder paste to the component pads. After the printed circuit board bare board solder paste is printed, the relevant electronic components are installed by reflow soldering, and then reflow soldering is performed.

2. Single-sided DIP cartridge

The PCB boards that need to be inserted are wave soldered by the production line workers after the electronic components are inserted, and the feet can be cut and cleaned after the soldering is fixed. However, the production efficiency of wave soldering is very low.

3. Single side mixed loading

The PCB board is printed with solder paste, installed with electronic components, and then fixed with reflow soldering. After quality inspection, insert DIP, and then perform wave soldering or manual soldering. If there are few through-hole components, manual soldering is recommended.

4. Single-sided installation and plug-in hybrid

Some PCB boards are double-sided, with one side attached and the other side inserted. The process of installation and insertion is the same as single-sided processing, but the PCB reflow and wave soldering require fixtures.

5. Double-sided SMT installation

For the aesthetics and functionality of the PCB board, some PCB board design engineers will adopt a double-sided mounting method. The integrated circuit components are arranged on the a side, and the chip components are mounted on the b side. Make full use of the PCB board space and minimize the PCB board area.

6. Double-sided mixed

The following two methods are mixed on both sides. .. One method is to heat the PCBA components three times, which is low in efficiency. It is not recommended to use red glue technology for wave soldering, because the soldering qualification rate is low. The second method is suitable for the situation where there are many SMT components on both sides and few THT components. Manual welding is recommended. If there are many THT components, wave soldering is recommended.