PCBA Tech - SMT term explanation: what is BOM, DIP, SMT, SMD

BOM

The bill of material (Bill of Material, BOM) is a file that describes the product structure in a data format is the bill of materials. The SMT processing BOM includes the material name, amount, and placement position number. The BOM is an important basis for placement machine programming and IPQC confirmation.

DIP package (DualIn-linePackage) is also called dual in-line packaging technology, which refers to integrated circuit chips packaged in dual in-line form. Most small and medium-sized integrated circuits use this packaging form, and the number of pins is generally not Over 100. The DIP packaged CPU chip has two rows of pins, which need to be inserted into the chip socket with the DIP structure.

SMT

Surface mount technology, called "SurfaceMountTechnology" in English, or SMT for short, is a circuit assembly technology for attaching and soldering surface mount components to a specified position on the surface of a printed circuit board. Specifically, it is to first apply solder paste on the printed circuit board, and then accurately place the surface mount components on the solder paste-coated pads, and heat the printed circuit board until the solder paste melts and cools down. After that, the interconnection between the component and the printed circuit board is realized. In the 1980s, SMT production technology became more and more perfect. The mass production of components used in surface mounting technology resulted in a significant drop in prices. Various types of equipment with good technical performance and low prices appeared one after another. Electronic products assembled with SMT were small in size. With the advantages of good performance, complete functions and low price, SMT, as a new generation of electronic assembly technology, is widely used in aviation PCBA, aerospace PCBA production, communication PCBA production, computer PCBA production, medical electronic PCBA production, automobile PCBA production, Electronic products smt patch in various fields such as office automation PCBA production and home appliance PCBA production. SMT features, high assembly density, small size and light weight of electronic products. The volume and weight of patch components are only about 1/10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced. 60%~80%.

SMD

SMD surface mount devices (SurfaceMounted Devices), "In the initial stage of electronic circuit board production, the via assembly is completely completed manually. After the first batch of automated machines are launched, they can place some simple pin components, but complex components are still Manual placement is required for wave soldering. Surface mount components were introduced about twenty years ago, and a new era was created. From passive components to active components and integrated circuits, they eventually became surface mount devices ( SMD) can be assembled by pick-and-place equipment. For a long time, people thought that all lead components could finally be packaged in SMD.