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Summary of the implementation process of SMT lead-free process

Summary of the implementation process of SMT lead-free process

Printed circuit boards {Printed circuit boards}, also known as printed circuit boards, are providers of electrical connections for electronic components.
Printed circuit boards are often represented by "PCB", but cannot be called "PCB boards".
Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is to greatly reduce wiring and assembly errors, and improve the level of automation and production labor rate.

1. Evaluate, manage and confirm ROHS compliance from manufacturers of materials, PCBs, and components to distributors. This is the key to ensuring the control of toxic and hazardous substances restricted in ROHS from the source.

2. According to specific products, select various materials that meet ROHS and conduct system evaluation.

Summary of the implementation process of SMT lead-free process

Solder paste: alloy and flux

Device: Solder tip and body material

Substrate: base material, pad surface layer and solder mask

3. Assess whether the current furnace meets the lead-free requirements, establish a ROHS-compliant production line, and strictly manage the Bb pollution according to the system.
4. Strict material management. Including procurement, packaging protection, marking, inventory conditions, management, and use.

5. Check and modify the PCB pad design (heat dissipation, layout) and stencil design.

6. Set correctly and carefully optimize the humidity curve, and keep the process stable.

7. Adopt lead-free quality inspection standards

It is currently in a special stage of transition from lead-free soldering. The standards for lead-free materials, printed boards, components, testing, and reliability are not perfect. There is no standard for management, and there is even no operating standard for how to achieve ROHS compliance, which brings many difficulties to the implementation of lead-free. Therefore, we must do more detailed work in all aspects. In addition, we must pay close attention to the dynamics of the ROHS process at home and abroad, especially the introduction of new standards, and follow the requirements of the standards.

In the implementation of lead-free processes, in the conversion process from lead-free products to lead-free products, it is necessary to understand the principle, process characteristics and process requirements of lead-free soldering, strictly manage, especially material management, and perform the process according to the correct method. More detailed.

In short, strict management, mastering the correct process method, and making the process more detailed are the keys to the correct implementation of the lead-free process.

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