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PCB Tech
The PCB board industry may soon usher in rapid growth
PCB Tech
The PCB board industry may soon usher in rapid growth

The PCB board industry may soon usher in rapid growth


    The country's first official announcement of the scope of "new infrastructure" PCB board industry may usher in rapid growth

    For the first time, three aspects of "new infrastructure" are clarified

At present, the new infrastructure mainly includes three aspects:

   One is information infrastructure. Mainly refers to the infrastructure generated based on the evolution of a new generation of information technology, such as the communication network infrastructure represented by 5G, Internet of Things, Industrial Internet, and satellite Internet, and new technologies represented by artificial intelligence, cloud computing, and blockchain. Technical infrastructure, computing power infrastructure represented by data centers and intelligent computing centers, etc.

The second is to converge infrastructure. Mainly refers to the in-depth application of technologies such as the Internet, big data, and artificial intelligence to support the transformation and upgrading of traditional infrastructure, and then the formation of integrated infrastructure, such as intelligent transportation infrastructure, smart energy infrastructure, etc.

    The third is innovation infrastructure. Mainly refers to infrastructures with public welfare attributes that support scientific research, technology development, and product development, such as major scientific and technological infrastructure, scientific and educational infrastructure, and industrial technological innovation infrastructure.

pcb board

    The scope of the new infrastructure interpreted by the National Development and Reform Commission is actually much broader. In addition to the 5G network, data center, artificial intelligence, industrial Internet, and Internet of Things that have been clearly mentioned in the previous official statement, cloud computing, blockchain, and intelligent computing centers that are often discussed in the industry are also included. High-speed rail, UHV, and new energy vehicle charging piles have not clearly appeared, but the integrated infrastructure includes smart transportation infrastructure and smart energy infrastructure. In addition, the statement on innovation infrastructure is clear for the first time, and major technology infrastructure, science and education infrastructure, and industrial technology innovation infrastructure are within the scope of new infrastructure.


  Will focus on 4 aspects of work

Regarding the next step of the new infrastructure, Wu Hao said that the National Development and Reform Commission will work with relevant departments to deepen research, strengthen overall planning, and improve the system, focusing on four aspects:

One is to strengthen the top-level design. Study and issue relevant guidelines for promoting the development of new infrastructure.

    The second is to optimize the policy environment. Focus on improving the quality and efficiency of the long-term supply of new infrastructure, revise and improve access rules that are conducive to the sustainable and healthy development of emerging industries.

    The third is to do a good job in project construction. Accelerate the deployment of 5G networks, promote the optimization and upgrading of optical fiber broadband networks, and accelerate the construction of a national integrated big data center. Steadily promote the "digital +" and "smart +" upgrades of traditional infrastructure. At the same time, advanced deployment of innovative infrastructure.

    The fourth is to do a good job in overall planning and coordination. Strengthen departmental coordination, and accelerate industry maturity and facility improvement through pilot demonstrations and compliance guidelines. Promote government-enterprise collaboration, stimulate the investment enthusiasm of various entities, and promote mutual promotion of technological innovation, deployment and construction, and integrated applications.


    48 trillion investment territory is coming

With multiple deployments at the policy level and the pursuit of the capital market, the "new infrastructure" has recently become popular! 24 provinces issued a large investment order of 48 trillion yuan. 21 Data News Lab found that as of March 5, 24 provinces and municipalities had announced their future investment plans, with a total investment of 48.6 trillion yuan in 22,000 projects. Among them, the total planned investment in 2020 is nearly 8 trillion yuan.


    "New infrastructure" exerts force, PCB industry may usher in rapid growth

5G is the infrastructure of the new infrastructure, and the 5G network is the prerequisite for the implementation of the application layer. Accelerated construction of base stations and data centers, corresponding PCB iteration upgrades, and simultaneous upgrades of industrial Internet, Internet of Things, consumer electronics terminals, etc., promoted the overall acceleration of the circuit board industry iteration. High-frequency and high-speed PCB is the core beneficiary of this round of new infrastructure. The upgrade of hardware specifications of base stations and servers requires that the dielectric constant and loss of PCB materials be reduced, and the increase in the number of components requires a high level of multi-layer layout.

Prismark predicts that the global PCB output value in 2019 will be approximately 63.7 billion U.S. dollars, a year-on-year increase of 2.1%. It is estimated that the global PCB output value will reach 74.756 billion US dollars in 2023. The global PCB industry market is still expanding, and the market prospects are considerable.

With the high value of high-frequency and high-speed PCBs, the boom cycle brought by the construction of 5G base stations, and relatively high technical barriers, the performance of related industry chain companies has brought about rapid growth. 2020 will be the first year of large-scale and heavy-duty base station construction. . With the adjustment of the industrial structure and the increase of production capacity concentration, the production technology of China's leading PCB companies will also be further improved. In the future, with the emergence of new needs such as automotive electronics, data centers, and artificial intelligence, the PCB industry will usher in new growth points.

Specifically, base station antennas, power amplifiers, and automotive radars are mainly high-frequency, and servers and base station transmission layers are mainly high-speed materials. Material and process upgrades have significantly increased the marginal elasticity of core suppliers; for CCL manufacturers, base station and server PCB upgrades drive high-frequency and high-speed CCL to accelerate volume, and the continuous expansion of hydrocarbon high-frequency, high-speed M4, and M6 demand core manufacturers are expected to usher in Both volume and price rise.