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PCB Tech

The problem of PCB ceramic packaging design components
2021-09-26
View:33
Author:Frank

The problem of PCB ceramic packaging design components
After drawing the schematic diagram, it is time to allocate packages for the components. The Stoneware cermet substrate suggests that it is best to use the packages in the system package library or the company package library, because these packages have been verified by the predecessors, can you not do the packaging yourself Don't do the packaging yourself. But in many cases, we still have to do the encapsulation by ourselves, or what should I pay attention to when doing encapsulation? First of all, we must have the package size of the Component or Module at hand. This general datasheet will have instructions. Some components have suggested packages in the datasheet. This is that we should design the package according to the recommendations in the datasheet; if only given in the datasheet The outline size, then the package is 0.5mm-1.0mm larger than the outline size.
If space permits, it is recommended to add an outline or frame to the Component or Module when encapsulating; if the space is really not allowed, you can choose to only add an outline or frame to part of the original. There are also some international standards for packaging at the original price. You can refer to IPC-SM-782A, IPC-7351 and other related materials.

pcb board

After you draw a package, please look at the following questions for comparison. If you have done all the following questions, then there should be no problems with the package you built!

(1) Is the lead pitch correct? If the answer is no, you may not even be able to solder!
(2) Is the pad design reasonable enough? Too big or too small pads are not conducive to soldering!
(3) Is the package you designed from the perspective of Top View? When designing the package, it is best to design the package from the perspective of Top View. The Top View of the cermet substrate of Stoner is the angle when the component pins are viewed from behind. If the package is not designed with a Top View angle, you will probably have to solder the components with four pins facing the sky after the board is completed (SMD components can only be soldered with four pins facing the sky) or on the back of the board (PTH components need to be soldered to the back).
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