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PCB Tech

PCB Tech

PCB Tech

PCB Tech

High-speed circuit PCB design skills
2021-08-11
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Author:IPCB

Via design skills in high-speed PCB, In high-speed PCB design, seemingly simple vias often bring great negative effects to circuit design. In order to reduce the adverse effects caused by the parasitic effects of the vias, the following can be done in the design.


Considering both cost and signal quality, choose a reasonable size via size. For example, for the 6-10 layer memory module PCB design, it is better to use 10/20Mil (drilled/pad) vias. For some high-density small-size boards, you can also try to use 8/18Mil. hole. Under current technical conditions, it is difficult to use smaller vias. For power or ground vias, you can consider using a larger size to reduce impedance.

High-speed circuit PCB design

High-speed circuit PCB design

The use of a thinner PCB board helps to reduce the two parasitic parameters (parasitic capacitance and parasitic inductance) of the via.


Try not to change the layers of the signal traces on the PCB board, that is, try not to use unnecessary vias.


The pins of the power supply and the ground should be punched nearby, and the leads between the vias and the pins should be as short as possible, because they will increase the inductance. At the same time, the power and ground leads should be as thick as possible to reduce pcb impedance.


Place some grounded vias near the vias of the signal change layer to provide the nearest return path for the signal. It is even possible to place a large number of redundant ground vias on the PCB board.