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Three wastes in the manufacturing process of PCB industry
PCB Tech
Three wastes in the manufacturing process of PCB industry

Three wastes in the manufacturing process of PCB industry

2021-11-08
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Author:Downs

Printed circuit board manufacturing technology is a very complex comprehensive processing technology, which can be divided into dry methods (such as design wiring, photo-engraving, filming, exposure, drilling, molding, etc.) and wet methods (such as chemical plating, electroplating, Etching, development, film removal, etc.). Internal oxidation, drilling, etc. Most wet processes need to use a large amount of water as the most basic raw material. In the production process of printed circuit boards, the waste liquid and waste water discharged from the cleaning process take away a lot of harmful substances. This waste water will deteriorate the environment and harm people's physical and mental health. Through a certain water treatment process, harmful substances are removed, so that the wastewater can meet the national discharge standards. Wastewater treatment technology.

In addition, some useful substances in the wastewater (such as copper in the etching solution, gold in the gold plating solution, etc.) must be recycled during the treatment process. In addition to waste water treatment, the "three wastes" control in pcb production also involves the recycling and treatment technology of waste water, waste gas, and solid waste.

pcb board

To solve the problem of the three wastes in the production of printed circuit boards, it is necessary to find out the source of its pollution. Whether it is dry or wet, harmful substances that pollute the environment will be produced. For example, in the process of producing pcb by subtraction, the main processes that produce pollution sources are as follows. Silver and organic matter are present in the waste developer and the waste fixer.

②Porosity and copper plating process. It contains a large amount of copper and a small amount of tin, formaldehyde, organic complexing agent, a small amount of palladium and chemical oxygen demand (COD). It contains a large amount of copper and a small amount of lead, tin, fluoroboric acid, chemical oxygen consumption, etc. in the wastewater and rinsing water; ③ within the oxidation process. Copper, sodium hypochlorite, lye, chemical oxygen consumption, etc.; drilling technology. Containing copper, potassium permanganate, organic reducing agent, etc.; (6) Gold plating process. It contains gold, nickel and trace amounts of cyanide. Some of them also contain trace amounts of lead and tin; drilling, sanding, milling, sawing, chamfering, slotting and other processing processes contain noise and dust that are harmful to the health of workers. The leftovers produced after contour processing contain a gold-plated layer. And gold powder; in PCB production, a large number of pollution sources are copper, and a small amount of pollution sources are lead, tin, nickel, silver, gold and manganese, fluorine, sodium hypochlorite, organic compounds and organic complexing agents, trace amounts of palladium and chloride. It is not difficult to see that in every production process, a large amount of harmful or recyclable substances will be produced. Acid mist, chloride and ammonia will be discharged into the air from the wet process workshop.

Therefore, PCB manufacturers need to remove harmful substances through certain water treatment technologies, so that the wastewater can only be discharged after reaching the national discharge standard, and it is not allowed to cause pollution to the environment.