CPU Chip Packaging Technology and Packaging Method
2021-07-26
CPU packaging technology is divided into dip packaging, QFP packaging, PFP packaging, PGA packaging, BGA packaging, etc.
CPU package forms: OPGA package, MPGA package, CPGA package, FC-PGA package, fc-pga2 package, Ooi package, PPGA package, s.e.c.c. package, s.e.c.2 package, s.e.p. package, PLGA package, cupga package, etc.
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