PCB Tech - Complete Version of PCB Production Process

Complete Version of PCB Production Process

Today brings you a complete version of the PCB production process, I hope you can have a deeper understanding of the PCB production!

PCB--Cut Lamination

Objective: according to the requirements of the engineering data MI, the large sheet meeting the requirements is cut into small pieces of production sheet and small pieces to meet the requirements of customers

Process: large board cutting according to MI requirements

PCB--Drill hole

Objective: according to the engineering data, drill the required hole diameter at the corresponding position on the plate with the required size

Process: lamination - put on board - drilling - put off board - inspection / repair

PCB--PTH

Objective: to deposit a thin layer of copper on the wall of insulating hole by chemical method

Process: rough grinding - hanging plate - automatic copper sinking line - lower plate - dilute H2SO4 - increase copper

PCB--Dry film

Objective: graphic transfer is to transfer the image on the production film to the board

Process: (solder mask process): board grinding - printing the first side - drying - printing the second side - drying - exposure - developing - inspection( Dry film process: pressing film - standing - alignment - exposure - standing - developing - inspection)

PCB--Etching

Objective: etching is to use chemical reaction method to remove the copper layer of non circuit parts

PCB--Solder mask

Objective: solder mask is to transfer the graphics of green ink, film to the board, so as to protect the circuit and prevent the tin on the circuit when welding parts

Process: grinding plate - printing photosensitive green oil - curium plate - exposure - development; board grinding - printing the first side - drying plate - printing the second side - drying plate

PCB--Silk screen

Objective: silk screen is a kind of mark which is easy to identify

Process: solder mask after final curium - cooling and standing - screen adjustment - character printing - back curium

PCB--Surface treament

Objective: to coat a nickel / gold layer with the required thickness on the plug finger, so as to make it have more hardness and wear resistance

Process: grinding board - degreasing - twice water washing - micro erosion - twice water washing - pickling - copper plating - water washing - nickel board - washing - gold plating

PCB--Outline

Objective: through the mold stamping or CNC gongs machine gongs out of the customer needs the shape forming method, organic gongs, beer board, gongs, hand cut

Note: the accuracy of data gong machine board and beer board is higher than that of hand Gong, and hand cutting board can only make some simple shapes

PCB--Test

Objective: to detect the open circuit, short circuit and other defects that are difficult to find by visual inspection

Process: mold loading - board setting - test - qualified - FQC visual inspection - unqualified - repair - return to test - OK - reject - scrap

PCB--Final inspection

Objective: through 100% visual inspection of plate appearance defects, and repair minor defects, to avoid problems and defective plate outflow

Specific work process: incoming materials - check data - visual inspection - qualified - FQA spot check - qualified - packaging - unqualified - treatment - check -OK

So, above this is the complete process about PCB, if you have any other suggestions, IPCB are welcome to communicate with you.

PCB Process